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74V1G126STR

STMicroelectronics

74V1G126STR by STMicroelectronics

74V1G126STR by STMicroelectronics is a CMOS bus driver with a propagation delay of just 10.5 ns, operating b/w 2-5.5 V. It features a compact low-profile package and supports dual ports with true output polarity. Ideal for high-speed data transmission in military applications, it operates from -55 °C to 125°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,311 parts In-Stock

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ComSIT Distribution GmbH

Germany . 6,000 parts In-Stock

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ComSIT USA

USA . 6,000 parts In-Stock

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Digiode

USA . 3,843 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 2,813 parts In-Stock

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Bristol Electronics

USA . 2,813 parts In-Stock

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Dan-Mar Components

USA . 2,813 parts In-Stock

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Anansix

USA . 2,246 parts In-Stock

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Distributors (Availability)

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Microchip USA

USA . 419 parts In-Stock

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$6.769

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$6.769

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Andel Nordic

Denmark . 4,373 parts In-Stock

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$6.991

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$6.711

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$6.711

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$6.711

IDEA Electronic Components Group

UK . 694 parts In-Stock

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$12.171

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$10.954

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AZTECH Wire

Italy . 1,135 parts In-Stock

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$12.200

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Native Components

USA . 212 parts In-Stock

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$16.202

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Northwest PG Solutions

USA . 655 parts In-Stock

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$17.822

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$16.040

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MKK Technologies

India . 1,814 parts In-Stock

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$22.886

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DigiPath Technology Company

USA . 1,814 parts In-Stock

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$22.886

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Corphita

USA . 3,665 parts In-Stock

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Perfect Parts

USA . 2,729 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,550 parts In-Stock

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Parana Technologies

USA . 1,445 parts In-Stock

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$14.552

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Overview

Unlock the power of efficient communication with the 74V1G126STR from STMicroelectronics! This high-quality bus driver and transceiver delivers unmatched performance in a compact package, perfect for a wide range of applications from consumer electronics to industrial systems. With a robust design ensuring reliable operation even in extreme temperatures, this device guarantees low propagation delays and superior signal integrity, empowering your projects with speed and precision. Trust STMicroelectronics for exceptional quality and innovation that drives your success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body ensures durability and resistance to environmental factors, making it suitable for various applications.

Propagation Delay At Nominal Supply: 10.5 ns

The low propagation delay allows for high-speed signal transmission, enhancing performance in fast-switching applications.

Surface Mount: YES

Surface mount technology optimizes board space and allows for automated manufacturing processes, improving overall efficiency.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration into existing designs and facilitates optimal layout on circuit boards.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V makes it compatible with a wide range of modern electronic systems.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF helps to minimize signal degradation and maintains signal integrity in high-frequency applications.

Power Supplies (V): 2/5.5

The wide range of power supply voltages (2V to 5.5V) adds versatility, allowing the product to be used in various circuit environments.

No. of Terminals: 5

With 5 terminals, this product provides multiple connections, making it suitable for complex circuit designs.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The low-profile package style helps conserve space on circuit boards, important for compact electronic designs.

Maximum I (ol): 4 Amp

A maximum output current of 4A allows it to drive significant loads, making it effective for high-power applications.

Propagation Delay (tpd): 10.5 ns

Repeating the low propagation delay of 10.5 ns emphasizes its capability for quick data transfer in high-performance systems.

Maximum Operating Temperature: 125 °C

The ability to operate at temperatures up to 125 °C makes this product suitable for high-temperature applications, enhancing reliability.

Output Characteristics: 3-STATE

The 3-state output capability allows for versatile interfacing with multiple devices, increasing design flexibility.

Minimum Operating Temperature: -55 °C

With a minimum operating temperature of -55 °C, this product is suitable for use in extreme environments, including military and aerospace.

Terminal Finish: TIN

Tin terminal finish provides good solderability and corrosion resistance, ensuring long-term reliability in connections.

Terminal Position: DUAL

Dual terminal position supports various PCB layouts, allowing for easier integration into existing systems.

No. of Ports: 2

Having 2 ports facilitates expandable designs, allowing multiple devices to communicate effectively.

Maximum Seated Height: 1.45 mm

A low seated height of 1.45mm is ideal for compact devices, improving overall design efficiency.

Width: 1.625 mm

The compact width of 1.625mm aids in the design of space-constrained applications.

Output Polarity: TRUE

True output polarity ensures predictable performance and compatibility with a broad range of logic circuits.

Minimum Supply Voltage (Vsup): 2 V

The minimum supply voltage of 2V enhances flexibility, allowing operation in low-power applications.

Length: 2.9 mm

The small length of 2.9mm contributes to the product's compact size, making it suitable for miniature designs.

Temperature Grade: MILITARY

Rated for military temperature grade, it meets strict reliability requirements for harsh environments.

Technology: CMOS

CMOS technology enables low power consumption, making it ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals facilitate experienced soldering, ensuring robust connections on circuit boards.

Packing Method: TR

Tape and reel (TR) packing method aids in automatic placement during manufacturing processes, enhancing production efficiency.

Terminal Pitch: 0.95 mm

A terminal pitch of 0.95mm allows for finer spacing in circuit designs, accommodating more components in a given area.

Control Type: ENABLE HIGH

High-enable control type simplifies interfacing with other devices, ensuring easier integration.

Maximum Supply Voltage (Vsup): 5.5 V

The ability to operate at a maximum supply voltage of 5.5V provides flexibility in power supply choices for different applications.

Technical Specifications

Bus Driver & Transceivers 74V1G126STR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE HIGH

Family:

74V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

10.5 ns

Propagation Delay (tpd):

10.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Width:

1.625 mm

Trade Compliance

74V1G126STR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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