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74V1G126CTR

STMicroelectronics

74V1G126CTR by STMicroelectronics

74V1G126CTR by STMicroelectronics is a CMOS bus driver with a propagation delay of just 10.5 ns, operating b/w 2-5.5 V. It features a compact design (1.25 mm width) and supports dual ports with true output polarity. Ideal for high-speed data transmission in military applications, it operates from -55 °C to 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 11,231 parts In-Stock

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11,231

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Digiode

USA . 4,248 parts In-Stock

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4,248

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J2 Sourcing AB

Sweden . 975 parts In-Stock

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975

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Anansix

USA . 716 parts In-Stock

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716

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Distributors (Availability)

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Andel Nordic

Denmark . 4,943 parts In-Stock

1+ parts

$4.097

100+ parts

-

1k+ parts

$3.933

10k+ parts

$3.933

4,943

$4.097

-

$3.933

$3.933

Microchip USA

USA . 318 parts In-Stock

1+ parts

$5.505

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-

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318

$5.505

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IDEA Electronic Components Group

UK . 1,118 parts In-Stock

1+ parts

$13.417

100+ parts

-

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$12.076

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1,118

$13.417

-

$12.076

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AZTECH Wire

Italy . 402 parts In-Stock

1+ parts

$21.830

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402

$21.830

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MKK Technologies

India . 2,138 parts In-Stock

1+ parts

$25.230

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2,138

$25.230

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DigiPath Technology Company

USA . 2,138 parts In-Stock

1+ parts

$25.230

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2,138

$25.230

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

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25,000

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Kepictronics

USA . 13,000 parts In-Stock

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13,000

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Corphita

USA . 3,894 parts In-Stock

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3,894

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A-Z Elektronik GmbH

Germany . 2,430 parts In-Stock

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2,430

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Parana Technologies

USA . 718 parts In-Stock

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$16.042

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718

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$16.042

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Native Components

USA . 688 parts In-Stock

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688

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Northwest PG Solutions

USA . 279 parts In-Stock

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279

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Overview

Elevate your designs with the 74V1G126CTR from STMicroelectronics, a trusted leader in semiconductor innovation. This high-performance bus driver offers exceptional efficiency and reliability, perfect for a wide array of applications including automotive, industrial, and consumer electronics. With its compact size and advanced technology, you gain quicker response times and reduced power consumption, empowering your projects to reach new heights without compromise on quality. Experience unmatched value and performance today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material ensures reliability and resistance to environmental factors.

Propagation Delay At Nominal Supply: 10.5 ns

Fast switching speed minimizes delay in signal transmission, making it suitable for high-speed applications.

Surface Mount: YES

Surface mount technology allows for compact designs and ease of assembly in modern circuit boards.

Package Shape: RECTANGULAR

Rectangular shape optimizes space on PCB and aligns with standard mounting configurations.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with low-voltage systems, making it energy-efficient and ideal for battery-operated devices.

Load Capacitance (CL): 50 pF

Low load capacitance allows for faster transitions and reduced power consumption in high-frequency applications.

Power Supplies (V): 2/5.5

Versatile power supply range accommodates different circuit requirements and enhances compatibility.

No. of Terminals: 5

Five-terminal configuration provides multiple connection points for flexible circuit design.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact and thin profile helps save space on the PCB, allowing for denser circuit designs.

Maximum I (ol): 4 Amp

High output current capability supports robust performance for powering multiple devices.

Propagation Delay (tpd): 10.5 ns

Consistent propagation delay ensures reliable performance in signal timing and synchronization.

Maximum Operating Temperature: 125 °C

High maximum temperature rating allows operation in harsh environments, enhancing reliability.

Output Characteristics: 3-STATE

3-state output ensures flexibility in bus systems, allowing for efficient communication among multiple devices.

Minimum Operating Temperature: -55 °C

Wide operating temperature range makes it suitable for extreme conditions, such as military or aerospace applications.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and ensures long-term reliability in connections.

Terminal Position: DUAL

Dual terminal position facilitates better layout options and more compact designs.

No. of Ports: 2

Dual ports allow for multi-channel communication, increasing versatility in system design.

Maximum Seated Height: 1.1 mm

Low profile ensures that the component will fit into compact assemblies with space constraints.

Width: 1.25 mm

Narrow width allows for space-efficient layout on circuit boards, particularly in high-density applications.

Output Polarity: TRUE

True output polarity simplifies integration into systems requiring specific output conditions.

Minimum Supply Voltage (Vsup): 2 V

Low minimum supply voltage enhances compatibility with a variety of low-power systems.

Length: 2 mm

Short length helps save space within tight PCBs and allows for a close arrangement of components.

Temperature Grade: MILITARY

MIL-SPEC grade ensures the product meets stringent reliability and performance standards required for military applications.

Technology: CMOS

CMOS technology provides low power consumption, high speed, and scalability for modern electronics.

Terminal Form: GULL WING

Gull wing terminals enhance soldering reliability and are widely used in automated assembly processes.

Packing Method: TR

Tape and reel packing simplifies handling and assembly in automated manufacturing environments.

Terminal Pitch: 0.65 mm

Standard terminal pitch allows for compatibility with various PCB designs and assembly techniques.

Control Type: ENABLE HIGH

High active enable control allows precise control over signal integrity and state management.

Maximum Supply Voltage (Vsup): 5.5 V

Flexibility in supply voltage allows for compatibility with various digital logic levels.

Technical Specifications

Bus Driver & Transceivers 74V1G126CTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE HIGH

Family:

74V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

10.5 ns

Propagation Delay (tpd):

10.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

1.25 mm

Trade Compliance

74V1G126CTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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