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SN74LV244APWRE4

Texas Instruments

SN74LV244APWRE4 by Texas Instruments

SN74LV244APWRE4 by Texas Instruments is a 2-function bus driver with 13.5ns propagation delay at 3.3V, suitable for automotive applications. It features a small outline package with 20 terminals and operates b/w -40 to 125°C temperature range. The device supports true output polarity and has a max power supply current of 0.02mA.

Median Price

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Lifecycle Status

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4

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1k+

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Chip Stock

USA . 281,320 parts In-Stock

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Vyrian

USA . 7,346 parts In-Stock

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Digiode

USA . 3,480 parts In-Stock

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Nova Conductors

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Andel Nordic

Denmark . 943 parts In-Stock

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$6.220

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$5.971

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943

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$8.327

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$7.910

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$7.910

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AZTECH Wire

Italy . 378 parts In-Stock

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$9.917

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Parana Technologies

USA . 1,037 parts In-Stock

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$21.297

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$21.615

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ChromeModa Solutions

Germany . 5,011 parts In-Stock

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$23.929

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$19.622

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IDEA Electronic Components Group

UK . 46 parts In-Stock

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$23.929

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$22.733

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$21.536

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Semicontronic

India . 1,049 parts In-Stock

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$29.000

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$28.275

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$28.130

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Corohmni

South Africa . 168 parts In-Stock

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One Stop Electronics

USA . 745 parts In-Stock

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Ampacity Inc.

Singapore . 1,227 parts In-Stock

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Continental Prestige Electronics

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Argo Parts USA

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Microchip USA

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Corphita

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Bastille Electronics

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DigiPath Technology Company

USA . 40 parts In-Stock

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Overview

Unlock the power of seamless data transmission with the Texas Instruments SN74LV244APWRE4 bus driver & transceiver. Crafted with precision and expertise, this product exemplifies the superior quality that TI is renowned for. Ideal for automotive applications, this dual-function device offers lightning-fast propagation delay, versatile 3-state output characteristics, and a compact design that ensures optimal performance in any setting. Say goodbye to connectivity issues and embrace unparalleled efficiency with the SN74LV244APWRE4 - the ultimate solution for your data transmission needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and reliability, making this product a good choice for long-lasting performance.

Propagation Delay At Nominal Supply: 13.5 ns

With a low propagation delay, this product ensures quick and efficient signal transmission, making it ideal for high-speed applications.

Surface Mount: YES

The surface mount capability allows for easy installation and space-saving on circuit boards, making this product convenient and versatile.

No. of Functions: 2

Having multiple functions in one device adds versatility and functionality, making this product suitable for various applications.

Package Shape: RECTANGULAR

The rectangular package shape provides a standard form factor for easy integration into existing circuit designs, enhancing compatibility and ease of use.

Nominal Supply Voltage / Vsup (V): 2.5

The 2.5V nominal supply voltage ensures efficient power consumption and compatibility with low-power systems, making this product energy-efficient.

Load Capacitance (CL): 50 pF

The 50 pF load capacitance allows for proper signal transmission and reception, ensuring reliable communication in the system.

Power Supplies (V): 3.3

The 3.3V power supply voltage is a common standard in electronics, providing compatibility with a wide range of systems and devices.

No. of Terminals: 20

Having 20 terminals enables easy connection and integration with other components, enhancing the versatility and functionality of this product.

Maximum I (ol): 16 Amp

The high maximum output current of 16 Amps allows for driving high-power loads, making this product suitable for demanding applications.

Propagation Delay (tpd): 18 ns

With a propagation delay of 18 ns, this product ensures fast signal transmission and reduced latency, improving overall system performance.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures reliability and stability in harsh environments, making this product suitable for automotive and industrial applications.

Output Characteristics: 3-STATE

The 3-STATE output characteristics provide flexibility in driving signals, allowing for tri-state control for bus systems, making this product versatile and adaptable.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures operability in cold conditions, making this product reliable in various temperature environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The nickel/palladium/gold terminal finish provides corrosion resistance and reliable electrical connections, ensuring long-term performance and durability.

Terminal Position: DUAL

Having dual terminal positions allows for flexible mounting options and easier PCB layout, making this product convenient and adaptable to different designs.

No. of Ports: 2

Having 2 ports enables bidirectional communication or connection to multiple devices, enhancing the connectivity and versatility of this product.

Maximum Seated Height: 1.2 mm

The low maximum seated height of 1.2 mm allows for compact and slim designs, making this product suitable for space-constrained applications.

Width: 4.4 mm

The narrow width of 4.4 mm enables space-saving on the PCB, allowing for efficient use of board space and integration in tight layouts.

Output Polarity: TRUE

The true output polarity ensures correct signal representation, helping to avoid errors in data transmission and processing, making this product reliable and accurate.

Minimum Supply Voltage (Vsup): 2 V

The low minimum supply voltage of 2V allows for operation in low-power scenarios, making this product suitable for energy-efficient and battery-powered applications.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this product can withstand high-temperature soldering processes, ensuring proper assembly and reliability in manufacturing.

Length: 6.5 mm

The compact length of 6.5 mm allows for space-efficient placement on the PCB, contributing to a streamlined and optimized circuit layout.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade designation ensures reliability and performance in automotive applications, making this product suitable for use in vehicles and transportation systems.

Technology: CMOS

Using CMOS technology provides low power consumption, high noise immunity, and fast switching speeds, making this product energy-efficient and reliable for digital applications.

Terminal Form: GULL WING

The gull wing terminal form allows for easy soldering and strong mechanical connections, ensuring secure mounting and reliable operation of this product.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65 mm enables high-density mounting on the PCB, allowing for compact and space-efficient designs in electronic systems.

Count Direction: UNIDIRECTIONAL

The unidirectional count direction simplifies signal processing and control, making this product straightforward to use and implement in digital systems.

Control Type: ENABLE LOW

The enable low control type ensures easy logic-level interfacing and signal control, simplifying the operation and integration of this product in electronic circuits.

Maximum Supply Voltage (Vsup): 5.5 V

The high maximum supply voltage of 5.5V allows for compatibility with a wide range of power sources and systems, providing versatility and flexibility in different applications.

Maximum Power Supply Current (ICC): 0.02 mA

With a maximum power supply current of 0.02 mA, this product operates with low power consumption, making it energy-efficient and suitable for battery-powered devices.

Technical Specifications

Bus Driver & Transceivers SN74LV244APWRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

16 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay At Nominal Supply:

13.5 ns

Propagation Delay (tpd):

18 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

SN74LV244APWRE4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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