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74V1T126S

STMicroelectronics

74V1T126S by STMicroelectronics

74V1T126S by STMicroelectronics is a CMOS bus driver with 8.5 ns propagation delay, suitable for military applications. It operates at a nominal voltage of 5V, has a load capacitance of 50 pF, and features a small outline package style.

Median Price

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Lifecycle Status

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3

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1k+

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Anansix

USA . 1,789 parts In-Stock

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1,789

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Digiode

USA . 1,431 parts In-Stock

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1,431

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Vyrian

USA . 500 parts In-Stock

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500

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Andel Nordic

Denmark . 636 parts In-Stock

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$2.246

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-

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$2.156

10k+ parts

$2.156

636

$2.246

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$2.156

$2.156

Native Components

USA . 839 parts In-Stock

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$9.840

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839

$9.840

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Northwest PG Solutions

USA . 2,112 parts In-Stock

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$10.824

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$9.742

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2,112

$10.824

$9.742

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IDEA Electronic Components Group

UK . 1,732 parts In-Stock

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$16.149

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$14.534

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1,732

$16.149

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$14.534

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MKK Technologies

India . 1,335 parts In-Stock

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$30.367

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1,335

$30.367

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DigiPath Technology Company

USA . 1,335 parts In-Stock

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$30.367

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1,335

$30.367

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Perfect Parts

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Corphita

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2,267

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Parana Technologies

USA . 412 parts In-Stock

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$19.308

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412

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$19.308

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Overview

Elevate your electronic designs with the STMicroelectronics 74V1T126S, a high-quality bus driver and transceiver that offers unparalleled performance and reliability. Manufactured by industry leader STMicroelectronics, this product boasts a sleek small outline package body material for easy installation. With a fast propagation delay of 8.5 ns, true output polarity, and military-grade temperature grade, the 74V1T126S is perfect for a wide range of applications. Experience the value and benefits of this top-notch component, designed to meet all your electronic needs with precision and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in portable bus driver and transceiver applications.

Propagation Delay At Nominal Supply: 8.5 ns

The low propagation delay ensures fast signal transmission, making this product suitable for high-speed data transfer in bus driver and transceiver systems.

Surface Mount: YES

The surface mount capability allows for easy and efficient PCB assembly, saving time and costs during the manufacturing process.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage ensures compatibility with common power sources, making this product versatile and easy to integrate into existing systems.

Load Capacitance (CL): 50 pF

The optimized load capacitance helps in reducing signal distortion and improving signal integrity, making this product reliable for bus driver and transceiver applications.

Power Supplies (V): 5

Having a dedicated power supply voltage of 5V simplifies the design and operation of the product, ensuring efficient power management in bus driver and transceiver systems.

No. of Terminals: 5

The compact design with a minimal number of terminals simplifies the PCB layout and minimizes the footprint, making this product space-efficient for applications with limited space constraints.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The small outline, low profile, and shrink pitch package style saves space on the PCB, making it suitable for compact bus driver and transceiver designs with high component density.

Maximum I (ol): 8 Amp

The high output current capability of 8A ensures efficient and reliable signal transmission, making this product suitable for driving bus lines and transceivers with demanding load requirements.

Propagation Delay (tpd): 8.5 ns

The short propagation delay of 8.5ns ensures minimal signal latency, making this product ideal for applications requiring fast data transfer and real-time communication.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125 °C ensures reliable performance in harsh environmental conditions, making this product suitable for industrial and automotive applications.

Output Characteristics: 3-STATE

The 3-state output characteristics provide flexibility in controlling the bus lines, allowing for high impedance state when not driving the lines, improving power efficiency and signal integrity.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55 °C ensures reliable operation in cold environments, making this product suitable for outdoor and automotive applications subjected to extreme temperatures.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides good solderability and corrosion resistance, ensuring reliable connections and durability in bus driver and transceiver applications.

Terminal Position: DUAL

The dual terminal position facilitates easy PCB mounting and soldering, enhancing the ease of installation and maintenance of the product in bus driver and transceiver systems.

No. of Ports: 2

Having 2 ports allows for versatile connectivity options and signal routing capabilities, making this product suitable for applications requiring multiple data channels and communication interfaces.

Maximum Seated Height: 1.45 mm

The low seated height of 1.45mm reduces the overall profile of the product, making it suitable for slim and compact bus driver and transceiver designs.

Width: 1.625 mm

The narrow width of 1.625mm allows for space-efficient placement on the PCB, enabling compact and densely populated bus driver and transceiver layouts.

Output Polarity: TRUE

The true output polarity ensures accurate signal transmission and compatibility with standard communication protocols, making this product reliable for data transfer in bus driver and transceiver systems.

Minimum Supply Voltage (Vsup): 4.5 V

The low minimum supply voltage of 4.5V allows for operation in low-power environments, making this product energy-efficient and suitable for battery-powered bus driver and transceiver applications.

Length: 2.9 mm

The compact length of 2.9mm minimizes the physical footprint of the product, enabling space-saving integration in bus driver and transceiver systems with limited board space.

Temperature Grade: MILITARY

The military temperature grade ensures reliable performance in extreme temperature conditions and harsh operating environments, making this product suitable for rugged military and aerospace applications.

Technology: CMOS

The CMOS technology used in the product offers low power consumption and high noise immunity, making it ideal for energy-efficient and reliable operation in bus driver and transceiver applications.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and easy soldering, ensuring robust connections and durability in bus driver and transceiver systems subjected to mechanical stress.

Terminal Pitch: 0.95 mm

The fine terminal pitch of 0.95mm allows for high-density mounting on the PCB, enabling compact and space-efficient bus driver and transceiver layouts with close component placement.

Control Type: ENABLE HIGH

The enable high control type simplifies the operation and interface control of the product, enabling easy integration and efficient management of bus driver and transceiver functions.

Maximum Supply Voltage (Vsup): 5.5 V

The high maximum supply voltage of 5.5V ensures compatibility with a wide range of power sources and provides a safety margin for voltage spikes, making this product reliable and versatile in different operating conditions.

Technical Specifications

Bus Driver & Transceivers 74V1T126S attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE HIGH

Family:

74V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

8.5 ns

Propagation Delay (tpd):

8.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Width:

1.625 mm

Trade Compliance

74V1T126S Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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