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74V1T125CTR

STMicroelectronics

74V1T125CTR by STMicroelectronics

74V1T125CTR by STMicroelectronics is a CMOS bus driver with a propagation delay of just 8.5 ns, operating b/w -55 °C to 125°C. It features a compact 5-terminal design and supports up to 8A output current. Ideal for military applications requiring reliable signal transmission.

Median Price

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Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

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Pegasus Components GmbH

Germany . 45,000 parts In-Stock

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45,000

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Inland Empire Components Inc.

USA . 4,451 parts In-Stock

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Digiode

USA . 3,690 parts In-Stock

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3,690

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Bristol Electronics

USA . 3,000 parts In-Stock

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3,000

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ComSIT Distribution GmbH

Germany . 3,000 parts In-Stock

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Connector Distribution Corp

USA . 2,750 parts In-Stock

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2,750

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Right Parts Inc.

USA . 2,750 parts In-Stock

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2,750

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Vyrian

USA . 2,297 parts In-Stock

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Atlantic Semiconductor

USA . 1,841 parts In-Stock

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Anansix

USA . 1,237 parts In-Stock

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Prism Electronics

USA . 132 parts In-Stock

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132

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Semi Source

USA . 40 parts In-Stock

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40

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Distributors (Availability)

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Andel Nordic

Denmark . 3,416 parts In-Stock

1+ parts

$5.548

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$5.326

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$5.326

3,416

$5.548

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$5.326

$5.326

AZTECH Wire

Italy . 1,104 parts In-Stock

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$10.000

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1,104

$10.000

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IDEA Electronic Components Group

UK . 770 parts In-Stock

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$13.804

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$12.423

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770

$13.804

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$12.423

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Native Components

USA . 134 parts In-Stock

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$19.014

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$19.014

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Northwest PG Solutions

USA . 232 parts In-Stock

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$20.915

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$18.824

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$20.915

$18.824

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MKK Technologies

India . 1,706 parts In-Stock

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$25.957

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$25.957

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DigiPath Technology Company

USA . 1,706 parts In-Stock

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$25.957

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$25.957

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Component Stockers USA

USA . 293 parts In-Stock

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$99.990

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Perfect Parts

USA . 75,340 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 25,509 parts In-Stock

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

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Metaverse IC Inc.

Canada . 10,231 parts In-Stock

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Kepictronics

USA . 10,000 parts In-Stock

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Microchip USA

USA . 4,081 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,800 parts In-Stock

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Corphita

USA . 558 parts In-Stock

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558

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Parana Technologies

USA . 140 parts In-Stock

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$16.504

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140

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$16.504

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Overview

Unlock unparalleled performance with the 74V1T125CTR from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This compact bus driver promises lightning-fast signal propagation and exceptional reliability, making it perfect for demanding applications in automotive, industrial, and telecommunications. With its robust temperature range and energy-efficient design, it ensures operational excellence while optimizing power consumption. Elevate your projects with a product that embodies quality and efficiency!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures robustness and longevity in various applications.

Propagation Delay At Nominal Supply: 8.5 ns

A low propagation delay allows for high-speed data transmission, making it suitable for fast communications.

Surface Mount: YES

Surface mount technology enables compact designs and efficient assembly processes, saving space on PCBs.

Package Shape: RECTANGULAR

The rectangular package shape provides a standardized footprint, facilitating ease of integration into designs.

Nominal Supply Voltage / Vsup (V): 5

A standard nominal supply voltage enhances compatibility with widely-used electronic systems.

Load Capacitance (CL): 50 pF

Low load capacitance ensures minimal signal distortion and improved performance in high-speed applications.

Power Supplies (V): 5

Designed to operate with 5V power supplies, this component fits seamlessly into typical electronic circuits.

No. of Terminals: 5

A 5-terminal layout offers straightforward integration while providing necessary functionality.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small and thin profile allows for high-density PCB layouts, optimizing space utilization.

Maximum I (ol): 8 Amp

Capable of handling high output currents, making it suitable for demanding applications.

Propagation Delay (tpd): 8.5 ns

Similar to the nominal propagation delay specification, this detail reinforces high-speed data handling capabilities.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature ensures reliability in challenging environments and extended operational range.

Output Characteristics: 3-STATE

3-state output allows for versatile operation in multi-device environments, enhancing system flexibility.

Minimum Operating Temperature: -55 °C

The capability to operate in extreme cold conditions makes this product suitable for military and aerospace applications.

Terminal Finish: MATTE TIN

Matte tin finish enhances solderability and reduces risk of oxidation, ensuring reliable connections.

Terminal Position: DUAL

Dual terminal positioning facilitates easier routing and integration on printed circuit boards.

No. of Ports: 2

With two ports available, it allows for communication between multiple devices, enhancing design flexibility.

Maximum Seated Height: 1.1 mm

A low seated height promotes compact design and fits into tight spaces on modern circuit boards.

Width: 1.25 mm

The slim width allows for tight layouts, which is beneficial in space-constrained applications.

Output Polarity: TRUE

True output polarity ensures straightforward interfacing with other components in a system.

Minimum Supply Voltage (Vsup): 4.5 V

A minimum supply voltage of 4.5V allows flexibility in various power source configurations.

Length: 2 mm

The short length contributes to compact designs while maintaining efficient performance.

Temperature Grade: MILITARY

The military-grade rating indicates high reliability and robustness, suitable for demanding applications.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high efficiency, ideal for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminals enhance reliable soldering and ease of mounting, improving assembly processes.

Packing Method: TR

Tape and reel packing method facilitates efficient handling and placement during manufacturing.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for modern compact designs and high-density layouts.

Control Type: ENABLE LOW

The enable low control type is straightforward to implement in digital logic designs, simplifying circuit control.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5V accommodates a wide range of applications while ensuring safety margins.

Technical Specifications

Bus Driver & Transceivers 74V1T125CTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW

Family:

74V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

8.5 ns

Propagation Delay (tpd):

8.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

1.25 mm

Trade Compliance

74V1T125CTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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