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74V1T126STR

STMicroelectronics

74V1T126STR by STMicroelectronics

74V1T126STR by STMicroelectronics is a CMOS bus driver with a propagation delay of just 8.5 ns, operating b/w -55 °C to 125°C. It features a low-profile design and supports dual ports with a max output current of 8 A. Ideal for high-speed data transmission in military applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Zilex Electronics Inc.

Canada . 21,000 parts In-Stock

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21,000

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ComSIT Distribution GmbH

Germany . 18,000 parts In-Stock

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18,000

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Digiode

USA . 4,839 parts In-Stock

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4,839

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Vyrian

USA . 4,644 parts In-Stock

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4,644

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Anansix

USA . 443 parts In-Stock

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443

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 1,868 parts In-Stock

1+ parts

$5.928

100+ parts

-

1k+ parts

$5.691

10k+ parts

$5.691

1,868

$5.928

-

$5.691

$5.691

Native Components

USA . 417 parts In-Stock

1+ parts

$13.854

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-

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417

$13.854

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AZTECH Wire

Italy . 629 parts In-Stock

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$14.790

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629

$14.790

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Northwest PG Solutions

USA . 1,480 parts In-Stock

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$15.239

100+ parts

$13.715

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1,480

$15.239

$13.715

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Microchip USA

USA . 448 parts In-Stock

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$16.251

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448

$16.251

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IDEA Electronic Components Group

UK . 1,083 parts In-Stock

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$20.761

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$18.685

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1,083

$20.761

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$18.685

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MKK Technologies

India . 1,532 parts In-Stock

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$39.039

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1,532

$39.039

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DigiPath Technology Company

USA . 1,532 parts In-Stock

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$39.039

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1,532

$39.039

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Component Stockers USA

USA . 329 parts In-Stock

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$99.990

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329

$99.990

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Perfect Parts

USA . 10,080 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,661 parts In-Stock

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Corphita

USA . 1,428 parts In-Stock

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Kepictronics

USA . 1,400 parts In-Stock

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1,400

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Parana Technologies

USA . 846 parts In-Stock

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$24.823

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846

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$24.823

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Overview

Elevate your designs with the 74V1T126STR from STMicroelectronics, a leader in innovative semiconductor solutions. This bus driver delivers exceptional performance with its low propagation delay, enabling faster data transfer for high-demand applications. Its compact and robust design ensures reliability even in extreme conditions, making it ideal for automotive, industrial, and consumer electronics. Trust STMicroelectronics for quality that drives your projects forward!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and protection against environmental factors, making the product reliable in various applications.

Propagation Delay At Nominal Supply: 8.5 ns

A low propagation delay ensures fast signal transmission, making this bus driver suitable for high-speed applications.

Surface Mount: YES

Surface mount technology allows for compact design and easier integration onto PCBs, enhancing space efficiency.

Package Shape: RECTANGULAR

A rectangular package shape facilitates easier layout on PCBs, optimizing space and improving manufacturability.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V is standard for many digital circuits, ensuring compatibility with various systems.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF helps maintain signal integrity and reduces the risk of distortion, especially in high-speed applications.

Power Supplies (V): 5

Support for a standard power supply voltage simplifies design requirements and power management in electronic systems.

No. of Terminals: 5

Five terminals provide sufficient connections for versatile applications while maintaining a compact design.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

This packaging style is excellent for minimizing space on PCBs, ideal for modern compact electronic designs.

Maximum I (ol): 8 Amp

The capacity to handle up to 8 Amps makes this product suitable for driving larger loads, enhancing its usability in various scenarios.

Propagation Delay (tpd): 8.5 ns

Consistent propagation delay indicates reliable performance, crucial for synchronizing signals in complex applications.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature ensures the product can function effectively in demanding environments.

Output Characteristics: 3-STATE

The 3-state output characteristic allows for better control of data lines, enabling efficient communication between devices.

Minimum Operating Temperature: -55 °C

Operating at extremely low temperatures increases reliability in harsh conditions, making it suitable for military and aerospace applications.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish ensures superior conductivity and resistance to corrosion, extending the product’s lifespan.

Terminal Position: DUAL

Dual terminal position design simplifies PCB layout and increases versatility in application.

No. of Ports: 2

Having two ports allows for greater connectivity options, making it suitable for various communication protocols.

Maximum Seated Height: 1.45 mm

A low seated height enables the bus driver to fit into compact spaces, crucial for dense electronic designs.

Width: 1.625 mm

Narrow width aids in higher density designs while maintaining performance integrity.

Output Polarity: TRUE

True output polarity ensures that the signal logic remains consistent, reducing design complexity.

Minimum Supply Voltage (Vsup): 4.5 V

Wide range of supply voltage ensures compatibility with various systems and reduces power requirements.

Length: 2.9 mm

Compact length helps save PCB space while fitting in tight electronic assemblies.

Temperature Grade: MILITARY

MILITARY grade means enhanced reliability and performance under extreme conditions, suitable for critical applications.

Technology: CMOS

CMOS technology ensures low power consumption while maintaining high-speed operation, essential for energy-efficient designs.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical stability and ease of soldering, enhancing manufacturing reliability.

Packing Method: TR

Taped reel (TR) packing method allows for automated handling and placement, streamlining production processes.

Terminal Pitch: 0.95 mm

A terminal pitch of 0.95 mm facilitates compatibility with high-density designs, optimizing PCB layouts.

Control Type: ENABLE HIGH

ENABLE HIGH control type simplifies circuit design, providing ease of integration in digital systems.

Maximum Supply Voltage (Vsup): 5.5 V

The ability to handle a maximum supply voltage of 5.5V ensures flexibility in power supply design and broader compatibility.

Technical Specifications

Bus Driver & Transceivers 74V1T126STR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE HIGH

Family:

74V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

8.5 ns

Propagation Delay (tpd):

8.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Width:

1.625 mm

Trade Compliance

74V1T126STR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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