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74V1G125CTR

STMicroelectronics

74V1G125CTR by STMicroelectronics

74V1G125CTR by STMicroelectronics is a CMOS bus driver with a propagation delay of just 10.5 ns, operating b/w 2-5.5 V. It features a compact design with a max height of 1.1 mm and supports dual ports for efficient signal management in military applications.

Median Price

$1.168

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Electronics Inc.

Canada . 6 parts In-Stock

1+ parts

$1.150

100+ parts

$0.870

1k+ parts

$0.750

10k+ parts

-

6

$1.150

$0.870

$0.750

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Voyager Components

USA . 150 parts In-Stock

1+ parts

$1.186

100+ parts

$1.186

1k+ parts

$1.186

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$1.186

150

$1.186

$1.186

$1.186

$1.186

Vyrian

USA . 6,560 parts In-Stock

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6,560

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Digiode

USA . 4,241 parts In-Stock

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4,241

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Standard Data Resources

USA . 3,000 parts In-Stock

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3,000

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ZD Integrated Circuits Inc.

USA . 2,668 parts In-Stock

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2,668

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LIBRA Elektronik GmbH

Germany . 2,645 parts In-Stock

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2,645

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Pegasus Components GmbH

Germany . 742 parts In-Stock

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742

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Anansix

USA . 312 parts In-Stock

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312

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 117 parts In-Stock

1+ parts

$5.359

100+ parts

-

1k+ parts

$5.145

10k+ parts

$5.145

117

$5.359

-

$5.145

$5.145

Microchip USA

USA . 262 parts In-Stock

1+ parts

$11.147

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-

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262

$11.147

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IDEA Electronic Components Group

UK . 1,653 parts In-Stock

1+ parts

$11.656

100+ parts

-

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$10.491

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1,653

$11.656

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$10.491

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Aztec Data Supply Inc.

USA . 1,000 parts In-Stock

1+ parts

$12.299

100+ parts

-

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1,000

$12.299

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AZTECH Wire

Italy . 106 parts In-Stock

1+ parts

$13.920

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106

$13.920

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MKK Technologies

India . 579 parts In-Stock

1+ parts

$21.919

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579

$21.919

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DigiPath Technology Company

USA . 579 parts In-Stock

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$21.919

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579

$21.919

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Authorized Procurement Solutions

USA . 32,000 parts In-Stock

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32,000

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Kepictronics

USA . 10,000 parts In-Stock

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Corphita

USA . 4,905 parts In-Stock

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4,905

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A-Z Elektronik GmbH

Germany . 4,664 parts In-Stock

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4,664

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Northwest PG Solutions

USA . 1,582 parts In-Stock

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1,582

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Assy Fe

Spain . 1,000 parts In-Stock

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1,000

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Parana Technologies

USA . 894 parts In-Stock

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$13.937

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894

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$13.937

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Native Components

USA . 718 parts In-Stock

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718

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Overview

Unlock the potential of your designs with the 74V1G125CTR by STMicroelectronics, a premier bus driver and transceiver that combines cutting-edge technology and exceptional reliability. Crafted from high-quality materials and designed for efficiency, this component delivers swift data transmission with minimal power consumption. Ideal for diverse applications—from automotive to industrial systems—its compact design ensures seamless integration, empowering you to elevate your projects while enjoying long-lasting performance and peace of mind. Choose STMicroelectronics for innovation that drives success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the body material ensures durability, lightweight properties, and effective protection from environmental factors.

Propagation Delay At Nominal Supply: 10.5 ns

A low propagation delay enhances the speed of data transmission, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount technology allows for efficient and compact circuit designs, making it suitable for modern electronics.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on the PCB, allowing for more efficient layout and design.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V makes it compatible with a wide range of low-power applications.

Load Capacitance (CL): 50 pF

Low load capacitance ensures minimal signal distortion and better performance in signal integrity.

Power Supplies (V): 2/5.5

The flexibility of operating with a power supply range of 2 to 5.5V allows for versatile design options.

No. of Terminals: 5

A compact design with 5 terminals simplifies connections and minimizes PCB space usage.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile minimize footprint while providing reliable performance in tight spaces.

Maximum I (ol): 4 Amp

High output current support ensures that it can drive heavy loads without performance degradation.

Propagation Delay (tpd): 10.5 ns

Consistent propagation delay indicates reliable performance in synchronous applications.

Maximum Operating Temperature: 125 °C

The ability to operate at high temperatures makes this product suitable for harsh environments.

Output Characteristics: 3-STATE

3-state output provides flexibility in bus operations and enables multiple devices to share the same bus.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature ensures reliability in extreme cold conditions.

Terminal Finish: Matte Tin (Sn)

Matte tin finish promotes good solderability and enhances overall durability of the terminals.

Terminal Position: DUAL

Dual terminal positioning provides versatility in device placement on the PCB.

No. of Ports: 2

The presence of two ports allows for easy interface and connection in multiple applications.

Maximum Seated Height: 1.1 mm

Low seated height is advantageous for compact device designs where space is a concern.

Width: 1.25 mm

Narrow width aids in high-density designs, allowing for more components to fit within a limited area.

Output Polarity: TRUE

True output polarity supports a wide range of applications requiring defined output behavior.

Minimum Supply Voltage (Vsup): 2 V

A minimum supply voltage of 2V allows for energy-efficient operation in low-power designs.

Maximum Time At Peak Reflow Temperature (s): 30

An extended reflow time tolerance allows for compatibility with various assembly processes and conditions.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability ensures robust soldering and assembly options.

Length: 2 mm

Short length further contributes to space-efficient designs suitable for compact electronics.

Temperature Grade: MILITARY

MILITARY-grade specifications guarantee reliability and performance under extreme conditions.

Technology: CMOS

CMOS technology ensures low power consumption while maintaining high-speed performance.

Terminal Form: GULL WING

Gull wing terminals provide ease of handling and excellent soldering capability.

Packing Method: TR

Tape and reel packing facilitates easy handling and automated assembly processes.

Terminal Pitch: 0.65 mm

Small terminal pitch is ideal for compact designs, allowing for closer component placement.

Control Type: ENABLE LOW

Low-enable control simplifies usage in digital circuits, allowing for straightforward integration.

Maximum Supply Voltage (Vsup): 5.5 V

With a maximum supply voltage of 5.5V, it accommodates a variety of applications needing higher voltage.

Technical Specifications

Bus Driver & Transceivers 74V1G125CTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW

Family:

74V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

10.5 ns

Propagation Delay (tpd):

10.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

74V1G125CTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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