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74V1G08STR

STMicroelectronics

74V1G08STR by STMicroelectronics

STMicroelectronics 74V1G08STR logic gate has 2 inputs, 11ns propagation delay, and operates at a voltage range of 2-5.5V. It is used in military-grade applications due to its CMOS technology and small outline package with surface mount capability.

Median Price

$2.265

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (In-Stock)

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NAC Semi

USA . 750 parts In-Stock

1+ parts

$0.680

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750

$0.680

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Component Electronics Inc.

Canada . 5 parts In-Stock

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$3.850

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$2.880

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$2.500

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5

$3.850

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$2.500

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Chip Stock

USA . 9,300 parts In-Stock

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Vyrian

USA . 4,034 parts In-Stock

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Digiode

USA . 3,155 parts In-Stock

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ComSIT Distribution GmbH

Germany . 2,977 parts In-Stock

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Zilex Electronics Inc.

Canada . 2,800 parts In-Stock

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Extreme Components

USA . 2,676 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 2,497 parts In-Stock

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Bristol Electronics

USA . 2,497 parts In-Stock

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2,497

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Dan-Mar Components

USA . 2,497 parts In-Stock

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Anansix

USA . 2,288 parts In-Stock

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Sogenti Electronics

Canada . 2,120 parts In-Stock

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ECAB

Sweden . 2,000 parts In-Stock

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Elcom Components

USA . 285 parts In-Stock

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285

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Resion

USA . 168 parts In-Stock

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Prism Electronics

USA . 23 parts In-Stock

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AZTECH Wire

Italy . 470 parts In-Stock

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$15.220

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470

$15.220

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IDEA Electronic Components Group

UK . 635 parts In-Stock

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$15.416

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$13.874

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635

$15.416

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$13.874

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MKK Technologies

India . 923 parts In-Stock

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$28.988

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923

$28.988

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DigiPath Technology Company

USA . 923 parts In-Stock

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$28.988

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923

$28.988

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Perfect Parts

USA . 33,639 parts In-Stock

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Kepictronics

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Authorized Procurement Solutions

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Microchip USA

USA . 4,797 parts In-Stock

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S.R.D Solutions

India . 3,000 parts In-Stock

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Infinite Electronics LLP (Excess)

. 2,837 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,700 parts In-Stock

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Corphita

USA . 2,185 parts In-Stock

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Native Components

USA . 836 parts In-Stock

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Parana Technologies

USA . 317 parts In-Stock

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$18.432

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Speed Components Ltd (Excess)

Israel . 60 parts In-Stock

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Assy Fe

Spain . 50 parts In-Stock

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Northwest PG Solutions

USA . 10 parts In-Stock

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Overview

Unleash the power of innovation with the 74V1G08STR logic gate by STMicroelectronics. Crafted with precision and expertise, this high-quality component offers lightning-fast propagation delay and durable construction. Ideal for a wide range of applications, from consumer electronics to industrial automation, this logic gate excels in performance and reliability. Elevate your projects with the unmatched value and efficiency that only STMicroelectronics can provide. Choose excellence, choose the 74V1G08STR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the logic gates, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 11 ns

The low propagation delay ensures fast processing and response times, making it suitable for high-speed applications.

Surface Mount: YES

Being surface mountable makes the installation process easier and more convenient, especially for compact circuit designs.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a lower supply voltage of 3.3V helps in reducing power consumption, making it energy-efficient.

Maximum Seated Height: 1.45 mm

The compact size and low profile design of this product enable it to be easily integrated into space-constrained electronic devices.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various voltage levels, making it a reliable choice for digital circuits.

Technical Specifications

Logic Gates 74V1G08STR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

74V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

11 ns

Propagation Delay (tpd):

11 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.45 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.625 mm

Trade Compliance

74V1G08STR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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