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74V1G04CTR

STMicroelectronics

74V1G04CTR by STMicroelectronics

74V1G04CTR from STMicroelectronics is a CMOS logic gate with a propagation delay of just 11.5 ns, operating b/w 2-5.5 V. It features a compact SOIC package and supports high temperatures up to 125 °C, making it ideal for military applications. Its low load capacitance of 50 pF ensures efficient performance in various electronic circuits.

Median Price

$0.380

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (In-Stock)

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SIE Connect GmbH - GreenChips

Germany . 10,691 parts In-Stock

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Greenchips

USA . 6,000 parts In-Stock

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Vyrian

USA . 5,368 parts In-Stock

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Netsource Technology, Inc.

USA . 3,330 parts In-Stock

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R&J Components

USA . 3,000 parts In-Stock

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J2 Sourcing AB

Sweden . 2,451 parts In-Stock

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Lakeland Logistics Inc

USA . 1,491 parts In-Stock

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Anansix

USA . 810 parts In-Stock

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Digiode

USA . 810 parts In-Stock

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810

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Bristol Electronics

USA . 197 parts In-Stock

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$0.380

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$0.219

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197

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$0.380

$0.219

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Prism Electronics

USA . 32 parts In-Stock

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32

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Distributors (Availability)

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Microchip USA

USA . 210 parts In-Stock

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$1.303

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210

$1.303

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AZTECH Wire

Italy . 35 parts In-Stock

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$10.270

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35

$10.270

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IDEA Electronic Components Group

UK . 543 parts In-Stock

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$17.331

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$15.598

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543

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MKK Technologies

India . 1,565 parts In-Stock

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$32.590

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DigiPath Technology Company

USA . 1,565 parts In-Stock

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$32.590

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Perfect Parts

USA . 155,236 parts In-Stock

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GreenTree Electronics

Israel . 129,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,925 parts In-Stock

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Kepictronics

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Cyclops Electronics Ltd (Excess)

UK . 3,395 parts In-Stock

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Assy Fe

Spain . 3,000 parts In-Stock

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ChipstoGo Electronic ltd

UK . 2,990 parts In-Stock

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Parana Technologies

USA . 1,999 parts In-Stock

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$20.722

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Corphita

USA . 1,572 parts In-Stock

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Northwest PG Solutions

USA . 1,294 parts In-Stock

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$4.550

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Native Components

USA . 994 parts In-Stock

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$4.504

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994

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Overview

Unlock unparalleled performance with the 74V1G04CTR from STMicroelectronics, a leader in high-quality logic solutions. Designed for efficiency and reliability, this versatile CMOS gate operates seamlessly across various applications, from automotive to industrial controls. With its compact footprint and robust temperature tolerance, it ensures optimal functionality even in demanding environments. Choose STMicroelectronics for innovation that empowers your designs—experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliability and longevity in various applications.

Propagation Delay At Nominal Supply: 11.5 ns

A low propagation delay enhances performance, making this logic gate suitable for high-speed applications.

Surface Mount: YES

Surface mount technology allows for compact designs and ease of integration into modern circuit boards.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient layout and effective space utilization on PCBs.

Nominal Supply Voltage / Vsup (V): 3.3

Designed to operate at a nominal voltage of 3.3V, this logic gate is compatible with standard low-voltage logic systems.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF allows for proper operation in various circuit configurations without signal degradation.

Power Supplies (V): 2/5.5

Versatile power supply range from 2V to 5.5V makes it adaptable for different electronic environments.

No. of Terminals: 5

Five terminals offer a balanced connection setup to facilitate complex logic functionalities.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile make it suitable for space-constrained applications, such as mobile devices.

Maximum I (ol): 4 Amp

A high maximum output current of 4 Amp makes this logic gate capable of handling substantial loads.

Propagation Delay (tpd): 11.5 ns

Consistency in propagation delay ensures reliable performance across different operating conditions.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature rating allows this logic gate to perform well in demanding environments.

Minimum Operating Temperature: -55 °C

The capability to function at low temperatures makes it suitable for extreme applications or environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The quality terminal finish enhances conductivity and resistance to corrosion, boosting durability.

Terminal Position: DUAL

Dual terminal positioning offers flexibility for various circuit designs, aiding in versatile connectivity.

Maximum Seated Height: 1.1 mm

A low seated height ensures compatibility with low-profile designs, supporting sleek modern devices.

Width: 1.25 mm

A narrow width allows for increased densities in PCB layouts, optimizing space usage.

Minimum Supply Voltage (Vsup): 2 V

With a minimum supply voltage of 2V, it can be powered in lower voltage applications, improving versatility.

Maximum Time At Peak Reflow Temperature (s): 30

A specified peak reflow time ensures compatibility with automated assembly processes without damaging components.

Peak Reflow Temperature (°C): 260

High peak reflow temperature capability ensures reliability during soldering processes in manufacturing.

Length: 2 mm

The compact length contributes to smaller footprints in circuit designs, ideal for miniaturized electronics.

Temperature Grade: MILITARY

This military-grade component meets strict reliability standards, making it suitable for critical applications.

Technology: CMOS

Utilizing CMOS technology ensures lower power consumption and efficient operation, enhancing overall system effectiveness.

Terminal Form: GULL WING

Gull wing terminal form allows for easy soldering and robust mechanical connection, improving assembly reliability.

Packing Method: TR

The TR packing method facilitates efficient logistics and handling, essential for high-volume applications.

Terminal Pitch: 0.65 mm

A fine terminal pitch allows for a compact design and high-density integration, supporting advanced electronic layouts.

Maximum Supply Voltage (Vsup): 5.5 V

With a maximum supply voltage of 5.5V, it can be integrated into more powerful applications while ensuring safe operation.

Technical Specifications

Logic Gates 74V1G04CTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

74V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

11.5 ns

Propagation Delay (tpd):

11.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

74V1G04CTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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