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74V1G03CTR

STMicroelectronics

74V1G03CTR by STMicroelectronics

74V1G03CTR by STMicroelectronics is a CMOS logic gate with a propagation delay of just 11 ns and operates at supply voltages b/w 2V and 5.5V. It features an open-drain output, making it ideal for interfacing applications. With a compact size and military-grade temperature range, it's perfect for reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 1,458 parts In-Stock

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1,458

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Digiode

USA . 796 parts In-Stock

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796

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Vyrian

USA . 108 parts In-Stock

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108

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Distributors (Availability)

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Native Components

USA . 167 parts In-Stock

1+ parts

$0.409

100+ parts

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$0.393

167

$0.409

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$0.393

Northwest PG Solutions

USA . 1,173 parts In-Stock

1+ parts

$0.450

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$0.397

1,173

$0.450

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$0.397

IDEA Electronic Components Group

UK . 2,267 parts In-Stock

1+ parts

$28.864

100+ parts

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$25.978

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2,267

$28.864

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$25.978

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MKK Technologies

India . 1,528 parts In-Stock

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$54.277

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1,528

$54.277

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DigiPath Technology Company

USA . 1,528 parts In-Stock

1+ parts

$54.277

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1,528

$54.277

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Corphita

USA . 2,791 parts In-Stock

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2,791

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Parana Technologies

USA . 1,462 parts In-Stock

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$34.511

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1,462

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$34.511

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Overview

Elevate your designs with the 74V1G03CTR from STMicroelectronics, a leader in innovative solutions. This high-performance logic gate delivers unmatched reliability and speed, making it ideal for a myriad of applications, from automotive to industrial controls. With its compact design and low power consumption, you can seamlessly integrate it into your projects, ensuring efficiency without compromise. Trust STMicroelectronics for quality and performance that drives your success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and resistance to environmental factors, making it suitable for various applications.

Propagation Delay At Nominal Supply: 11 ns

With a low propagation delay, this logic gate allows for faster signal processing, improving the efficiency of electronic circuits.

Surface Mount: YES

The surface mount capability enables space-saving designs on PCBs, making it ideal for compact electronic devices.

No. of Inputs: 2

The dual input configuration allows for versatile application in logic operations, simplifying circuit design.

Package Shape: RECTANGULAR

The rectangular shape is conducive to efficient layout and soldering on printed circuit boards.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal voltage of 3.3V makes this product compatible with most modern digital systems.

Load Capacitance (CL): 50 pF

A low load capacitance ensures minimal signal distortion and faster operation, enhancing performance in high-speed applications.

Power Supplies (V): 2/5.5

Flexible power supply options allow for integration into various power supply environments, increasing application versatility.

No. of Terminals: 5

The 5-terminal design optimizes connectivity options while maintaining a compact form factor.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile allow for high-density placements on PCBs, ideal for space-constrained devices.

Maximum I (ol): 4 Amp

A maximum output current of 4A enables strong performance in driving loads, suitable for power applications.

Propagation Delay (tpd): 11 ns

Consistent 11 ns propagation delay supports reliable high-speed switching, critical for effective logic functioning.

Maximum Operating Temperature: 125 °C

High operating temperature tolerance ensures reliability in demanding environments and extends application range.

Output Characteristics: OPEN-DRAIN

Open-drain output configurations allow for wired-AND logic, enhancing versatility in circuit designs.

Minimum Operating Temperature: -55 °C

The capability to operate at -55 °C makes this logic gate suitable for extreme temperature applications, such as aerospace.

Terminal Finish: MATTE TIN

Matte tin finish provides excellent solderability and corrosion resistance for durable connections.

Terminal Position: DUAL

Dual terminal positioning allows for easy integration into circuits, addressing diverse design needs.

Maximum Seated Height: 1.1 mm

Low seated height is ideal for compact designs, enhancing the feasibility of low-profile gadgets.

Width: 1.25 mm

The narrow width contributes to space efficiency on PCBs, facilitating tighter layouts.

Minimum Supply Voltage (Vsup): 2 V

The low minimum supply voltage ensures compatibility with a broad range of systems, including battery-powered devices.

Length: 2 mm

The compact length enhances flexibility in design configurations, aiding in miniaturization efforts.

Temperature Grade: MILITARY

MILITARY-grade temperature classification assures reliability and performance in critical and rugged applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it a robust choice for various logic functions.

Terminal Form: GULL WING

Gull wing terminals provide enhanced mechanical stability and are easier to solder, ensuring reliability in assembly.

Packing Method: TR

Tape and reel packing facilitates automated assembly processes, streamlining production and installation.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm is conducive for modern high-density boards, allowing for tighter layouts in electronic designs.

Maximum Supply Voltage (Vsup): 5.5 V

The wide supply voltage range (up to 5.5V) enhances flexibility in designs, accommodating various operational needs.

Technical Specifications

Logic Gates 74V1G03CTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

74V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

11 ns

Propagation Delay (tpd):

11 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

1.25 mm

Trade Compliance

74V1G03CTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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