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74V1G05CTR

STMicroelectronics

74V1G05CTR by STMicroelectronics

74V1G05CTR by STMicroelectronics is a CMOS logic gate with a propagation delay of just 11 ns and operates at supply voltages b/w 2-5.5 V. Its open-drain output and compact size make it ideal for high-speed applications in military environments. With a max temp of 125 °C, it's reliable under extreme conditions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,073 parts In-Stock

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Bristol Electronics

USA . 3,000 parts In-Stock

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Anansix

USA . 1,934 parts In-Stock

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Vyrian

USA . 160 parts In-Stock

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160

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Northwest PG Solutions

USA . 302 parts In-Stock

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$2.930

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302

$2.930

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IDEA Electronic Components Group

UK . 535 parts In-Stock

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$11.111

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$10.000

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535

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MKK Technologies

India . 582 parts In-Stock

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$20.893

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$20.893

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DigiPath Technology Company

USA . 582 parts In-Stock

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$20.893

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582

$20.893

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Component Stockers USA

USA . 287 parts In-Stock

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$99.990

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Kepictronics

USA . 9,440 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 2,500 parts In-Stock

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Corphita

USA . 893 parts In-Stock

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Native Components

USA . 765 parts In-Stock

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Parana Technologies

USA . 439 parts In-Stock

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$13.285

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Overview

Unlock superior performance with the 74V1G05CTR from STMicroelectronics, a leader in advanced semiconductor solutions. This compact logic gate delivers lightning-fast response times and exceptional reliability, making it perfect for a wide range of applications—from industrial automation to consumer electronics. Enjoy the benefits of robust design, military-grade temperature resilience, and efficient power handling, ensuring your devices operate seamlessly under any conditions. Choose quality; choose STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides excellent insulation and protection for the internal components, ensuring reliability and durability in various applications.

Propagation Delay At Nominal Supply: 11 ns

A low propagation delay indicates fast switching speeds, making this logic gate suitable for high-speed digital circuits.

Surface Mount: YES

Surface mounting allows for easier PCB assembly and reduced space requirements, contributing to more compact designs.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space utilization on printed circuit boards.

Nominal Supply Voltage / Vsup (V): 3.3

This nominal voltage is standard for many modern digital systems, ensuring compatibility with various devices.

Load Capacitance (CL): 50 pF

A reasonable load capacitance ensures the device performs well in typical circuit conditions.

Power Supplies (V): 2/5.5

The flexible supply voltage range allows for versatile use in different applications.

No. of Terminals: 5

With five terminals, this device can easily integrate into a variety of circuit configurations.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact package style contributes to a smaller overall footprint on PCBs, ideal for space-constrained applications.

Maximum I (ol): 4 Amp

This high output current capability allows the device to drive larger loads, enhancing its usability in power-sensitive applications.

Propagation Delay (tpd): 12.5 ns

A slight increase in propagation delay compared to the nominal supply delay still ensures competitive switching times for digital applications.

Maximum Operating Temperature: 125 °C

This high maximum temperature rating makes the product suitable for use in harsh environments.

Output Characteristics: OPEN-DRAIN

Open-drain outputs provide flexibility in interfacing with other logic levels, making it ideal for wired-AND configurations.

Minimum Operating Temperature: -55 °C

The ability to function at extremely low temperatures ensures reliability in extreme weather conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This finish offers excellent corrosion resistance and ensures good solderability, improving the reliability of connections over time.

Terminal Position: DUAL

Dual terminal positioning aids in balanced load distribution and simplifies PCB layout.

Maximum Seated Height: 1.1 mm

The low profile reduces the overall height of the assembled device, benefiting compact design implementations.

Width: 1.25 mm

A narrow width allows for higher density PCB designs, accommodating more components in smaller areas.

Minimum Supply Voltage (Vsup): 2 V

This lower limit supports compatibility with low-voltage circuits, increasing versatility.

Maximum Time At Peak Reflow Temperature (s): 30

A controlled reflow time enhances solder joint reliability during assembly, reducing the risk of failure.

Peak Reflow Temperature °C: 260

This high reflow temperature supports compatibility with a wide range of solder materials, improving manufacturability.

Length: 2 mm

The compact length further supports space-saving design considerations, making it ideal for small form factor applications.

Temperature Grade: MILITARY

The military-grade classification ensures exceptional performance and reliability under challenging conditions, suitable for critical applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making it ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and handling during manufacturing processes, enhancing production efficiency.

Packing Method: TR

The tape and reel packing method simplifies automated PCB assembly processes, improving manufacturing efficiency.

Terminal Pitch: 0.65 mm

A moderately spaced terminal pitch ensures compatibility with various PCB layouts and manufacturing processes.

Maximum Supply Voltage (Vsup): 5.5 V

This maximum supply voltage accommodates a broad range of applications without compromising performance.

Technical Specifications

Logic Gates 74V1G05CTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

74V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

11 ns

Propagation Delay (tpd):

12.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

74V1G05CTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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