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74V1G05S

STMicroelectronics

74V1G05S by STMicroelectronics

74V1G05S by STMicroelectronics is a CMOS logic gate with 13 ns propagation delay, suitable for military applications. It operates at a supply voltage range of 2-5.5 V and has open-drain output characteristics. With a small outline package style and dual terminal position, it offers high performance in a compact form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,393 parts In-Stock

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Anansix

USA . 2,846 parts In-Stock

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2,846

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Vyrian

USA . 84 parts In-Stock

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84

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Distributors (Availability)

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Northwest PG Solutions

USA . 907 parts In-Stock

1+ parts

$2.372

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907

$2.372

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IDEA Electronic Components Group

UK . 109 parts In-Stock

1+ parts

$22.234

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$20.010

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109

$22.234

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$20.010

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MKK Technologies

India . 726 parts In-Stock

1+ parts

$41.809

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726

$41.809

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DigiPath Technology Company

USA . 726 parts In-Stock

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$41.809

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726

$41.809

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Corphita

USA . 4,798 parts In-Stock

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4,798

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Parana Technologies

USA . 1,222 parts In-Stock

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$26.584

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Native Components

USA . 713 parts In-Stock

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$2.092

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713

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$2.092

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Overview

Unlock the power of innovation with the 74V1G05S logic gate by STMicroelectronics. Crafted with precision and expertise, this versatile component offers reliable performance and efficiency in a wide range of applications. From industrial automation to consumer electronics, this high-quality product delivers unrivaled speed and accuracy, making it the perfect choice for your next project. Experience the difference with STMicroelectronics - where cutting-edge technology meets exceptional value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the logic gates.

Propagation Delay At Nominal Supply: 13 ns

The low propagation delay ensures fast signal processing, making this product suitable for applications where speed is critical.

Surface Mount: YES

Being surface mountable makes installation and soldering easier, especially in modern PCB designs where space optimization is important.

Nominal Supply Voltage / Vsup (V): 3.3

The nominal supply voltage of 3.3V makes this product compatible with a wide range of electronic systems and devices that operate at this voltage level.

Load Capacitance (CL): 50 pF

With a low load capacitance, this product is suitable for high-speed applications where capacitive loading can affect signal integrity.

Power Supplies (V): 2/5.5

This product is versatile in terms of power supply compatibility, able to operate within a range of 2V to 5.5V.

No. of Terminals: 5

The 5 terminals provide connectivity options for input, output, and power, making this product versatile for different circuit configurations.

Maximum I (ol): 4 Amp

The high maximum output current capability of 4A allows this product to drive heavier loads without the risk of overloading.

Propagation Delay (tpd): 12.5 ns

The low propagation delay of 12.5ns contributes to the overall high-speed performance of this product.

Maximum Operating Temperature: 125 °C

With a wide maximum operating temperature range of 125 °C, this product can withstand harsh environmental conditions and high-temperature applications.

Output Characteristics: OPEN-DRAIN

The open-drain output characteristics offer flexibility in connecting to other devices and components in the circuit.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55 °C ensures reliable performance even in cold environments or during start-up conditions.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides good solderability and corrosion resistance for long-term reliability.

Terminal Position: DUAL

The dual terminal position offers flexibility in PCB layout and provides multiple connection options for different circuit configurations.

Maximum Seated Height: 1.45 mm

The low maximum seated height of 1.45mm is ideal for applications where space constraints are a concern, allowing for compact designs.

Width: 1.625 mm

The narrow width of 1.625mm enables tight spacing on the PCB, which is beneficial for densely populated electronic assemblies.

Minimum Supply Voltage (Vsup): 2 V

The minimum supply voltage of 2V ensures compatibility with low-power systems and applications that require lower operating voltages.

Length: 2.9 mm

The compact length of 2.9mm contributes to the overall small form factor of this product, suitable for space-constrained designs.

Temperature Grade: MILITARY

The military-grade temperature rating ensures high reliability and performance in demanding environments, making this product suitable for rugged applications.

Technology: CMOS

The CMOS technology used in this product offers low power consumption and high noise immunity, making it ideal for battery-operated devices and noise-sensitive applications.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and ease of soldering during assembly, ensuring reliable connections on the PCB.

Terminal Pitch: 0.95 mm

The small terminal pitch of 0.95mm enables high-density mounting and finer pitch connections on the PCB, suitable for compact designs.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5V allows this product to operate in systems with higher voltage requirements without risk of damage.

Technical Specifications

Logic Gates 74V1G05S attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

74V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e0

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

13 ns

Propagation Delay (tpd):

12.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.45 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Width:

1.625 mm

Trade Compliance

74V1G05S Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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