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74V1G00CTR

STMicroelectronics

74V1G00CTR by STMicroelectronics

74V1G00CTR by STMicroelectronics is a CMOS logic gate with a propagation delay of just 11.5 ns and operates b/w 2-5.5 V. It features dual inputs, a compact SOIC package, and is ideal for high-speed digital circuits in military applications. Its robust design supports extreme temperatures from -55 °C to 125°C.

Median Price

$0.090

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Freelance Electronics

USA . 2,529 parts In-Stock

1+ parts

$0.090

100+ parts

$0.094

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$0.089

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2,529

$0.090

$0.094

$0.089

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Vyrian

USA . 5,853 parts In-Stock

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Cyclops Electronics Ltd

UK . 3,000 parts In-Stock

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Prism Electronics

USA . 2,965 parts In-Stock

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Anansix

USA . 2,157 parts In-Stock

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Digiode

USA . 741 parts In-Stock

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Native Components

USA . 39 parts In-Stock

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$0.428

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-

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$0.411

39

$0.428

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$0.411

Northwest PG Solutions

USA . 2,323 parts In-Stock

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$0.471

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$0.415

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$0.471

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$0.415

Microchip USA

USA . 209 parts In-Stock

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$5.422

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$5.422

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AZTECH Wire

Italy . 1,111 parts In-Stock

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$11.860

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$11.860

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Corohmni

South Africa . 55 parts In-Stock

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$23.363

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$23.711

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$21.577

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$19.443

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$19.443

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IDEA Electronic Components Group

UK . 2,083 parts In-Stock

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$30.193

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$27.173

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MKK Technologies

India . 2,016 parts In-Stock

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$56.775

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DigiPath Technology Company

USA . 2,016 parts In-Stock

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Perfect Parts

USA . 5,378 parts In-Stock

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Corphita

USA . 4,528 parts In-Stock

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Authorized Procurement Solutions

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A-Z Elektronik GmbH

Germany . 2,870 parts In-Stock

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Parana Technologies

USA . 867 parts In-Stock

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$36.100

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Overview

Elevate your designs with the 74V1G00CTR from STMicroelectronics, a premier choice in logic gates. Renowned for their commitment to high-quality semiconductor solutions, STMicroelectronics delivers exceptional performance and reliability. This compact 2-input CMOS gate operates efficiently across various applications, ensuring swift signal processing with minimal power consumption. Experience enhanced versatility and durability tailored for both consumer and industrial electronics, making it an essential component for innovators seeking superior functionality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material provides excellent protection and thermal stability.

Propagation Delay At Nominal Supply: 11.5 ns

Fast switching speed makes it suitable for high-speed applications.

Surface Mount: YES

Simplifies PCB design and assembly, saving space and improving performance.

No. of Inputs: 2

Flexibility to handle various logic operations efficiently.

Package Shape: RECTANGULAR

Optimizes layout on circuit boards for compact designs.

Nominal Supply Voltage / Vsup (V): 3.3

Standard voltage ensures compatibility with many modern digital circuits.

Load Capacitance (CL): 50 pF

Low load capacitance enhances speed and reduces power consumption.

Power Supplies (V): 2/5.5

Wide supply voltage range allows versatility across various applications.

No. of Terminals: 5

Adequate number of connections for multiple configurations.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Maximizes space efficiency and minimizes PCB footprint.

Maximum I (ol): 4 Amp

Capable of driving higher loads, making it suitable for robust applications.

Propagation Delay (tpd): 11.5 ns

Ensures quick response times, ideal for fast digital circuits.

Maximum Operating Temperature: 125 °C

High-temperature rating allows operation in demanding environments.

Minimum Operating Temperature: -55 °C

Wide temperature range ensures reliability in extreme conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality finish offers excellent corrosion resistance and solderability.

Terminal Position: DUAL

Facilitates easier routing and enhances design flexibility.

Maximum Seated Height: 1.1 mm

Low profile design supports high-density assemblies.

Width: 1.25 mm

Compact width allows for space-saving designs.

Minimum Supply Voltage (Vsup): 2 V

Ability to operate at lower voltages contributes to energy efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

Built for reliable assembly processes with robust thermal characteristics.

Peak Reflow Temperature °C: 260

High reflow temperature tolerance ensures compatibility with advanced soldering techniques.

Length: 2 mm

Compact length facilitates design in tight spaces.

Temperature Grade: MILITARY

Designed to meet stringent military standards for reliability and durability.

Technology: CMOS

CMOS technology enables low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminals provide good mechanical strength and ease of soldering.

Packing Method: TR

Tape and reel packaging ensures easy handling and automated assembly.

Terminal Pitch: 0.65 mm

Fine pitch supports high-density applications while remaining manageable for assembly.

Maximum Supply Voltage (Vsup): 5.5 V

Allows flexibility in design and can operate in varied conditions.

Technical Specifications

Logic Gates 74V1G00CTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

74V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

11.5 ns

Propagation Delay (tpd):

11.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

74V1G00CTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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