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74V1G02CTR

STMicroelectronics

74V1G02CTR by STMicroelectronics

74V1G02CTR by STMicroelectronics is a CMOS logic gate with a propagation delay of just 11.5 ns and operates at supply voltages b/w 2-5.5 V. It features dual inputs, a compact SOIC package, and is ideal for high-speed digital applications in military environments. Its robust design supports temperatures from -55 °C to 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,845 parts In-Stock

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2,845

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ComSIT Distribution GmbH

Germany . 1,783 parts In-Stock

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1,783

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Anansix

USA . 486 parts In-Stock

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486

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Vyrian

USA . 103 parts In-Stock

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103

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,009 parts In-Stock

1+ parts

$27.297

100+ parts

-

1k+ parts

$24.568

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-

1,009

$27.297

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$24.568

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MKK Technologies

India . 621 parts In-Stock

1+ parts

$51.331

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621

$51.331

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DigiPath Technology Company

USA . 621 parts In-Stock

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$51.331

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621

$51.331

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Ampacity Inc.

Singapore . 1,247 parts In-Stock

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$58.000

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$58.000

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Kepictronics

USA . 13,000 parts In-Stock

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13,000

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Metaverse IC Inc.

Canada . 11,400 parts In-Stock

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11,400

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Corphita

USA . 4,588 parts In-Stock

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4,588

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A-Z Elektronik GmbH

Germany . 4,500 parts In-Stock

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4,500

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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3,500

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Northwest PG Solutions

USA . 756 parts In-Stock

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756

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Native Components

USA . 450 parts In-Stock

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450

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Robosynatics

Brazil . 250 parts In-Stock

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250

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Lucentia Tech

USA . 250 parts In-Stock

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$31.405

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$29.081

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$29.081

250

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$31.405

$29.081

$29.081

Parana Technologies

USA . 189 parts In-Stock

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$32.638

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189

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$32.638

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Overview

Elevate your designs with the 74V1G02CTR from STMicroelectronics, a reliable logic gate that combines exceptional performance and durability. With its compact, thin-profile design and low propagation delay, it's perfect for applications in automotive, industrial, and consumer electronics. Trust in STMicroelectronics’ commitment to quality and innovation, ensuring you achieve optimal efficiency and reliability in every project. Experience unmatched value and enhance your solutions today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides a durable and lightweight casing, ensuring long-term reliability in various applications.

Propagation Delay at Nominal Supply: 11.5 ns

With a low propagation delay, this logic gate ensures fast switching speeds, making it suitable for high-speed digital circuits.

Surface Mount: YES

Surface mount capability allows for compact PCB designs, promoting space efficiency in electronic assemblies.

No. of Inputs: 2

Having two inputs provides flexibility for various circuit configurations, making it versatile in different logic designs.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient layout and placement on PCBs, optimizing space utilization.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V makes this component ideal for modern low-voltage digital systems.

Load Capacitance (CL): 50 pF

A manageable load capacitance enables effective interfacing with other digital components without significant signal degradation.

Power Supplies (V): 2/5.5

Wide power supply range allows for flexibility in power management across different circuit designs.

No. of Terminals: 5

The five terminals facilitate easy connectivity and integration into various electronic circuits.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small, thin profile is advantageous for high-density PCB layouts, ensuring a compact design.

Maximum I (ol): 4 Amp

The capability to handle up to 4 Amps makes this gate suitable for applications requiring significant output drive strength.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature allows for use in demanding environments without risking component failure.

Minimum Operating Temperature: -55 °C

The ability to operate at temperatures as low as -55 °C ensures reliable performance in extreme conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Premium terminal finishes enhance solderability and connection quality, improving overall reliability.

Terminal Position: DUAL

Dual terminal positioning allows for versatile mounting options, making it adaptable for various PCB layouts.

Maximum Seated Height: 1.1 mm

A low seated height contributes to a slim profile, important for space-constrained applications.

Width: 1.25 mm

Narrow width helps save PCB real estate, making it ideal for compact electronic designs.

Minimum Supply Voltage (Vsup): 2 V

A minimum supply voltage of 2V ensures compatibility with a wider range of applications.

Maximum Time At Peak Reflow Temperature (s): 30

This allows for safe soldering processes, protecting the device from thermal damage during assembly.

Peak Reflow Temperature °C: 260

A high peak reflow temperature assures compatibility with lead-free soldering processes.

Length: 2 mm

Short length aids in creating tighter layouts, essential for modern miniaturized electronics.

Temperature Grade: MILITARY

Being rated for military-grade temperatures guarantees robustness and reliability for critical applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making it suitable for battery-operated devices.

Terminal Form: GULL WING

Gull wing leads make for easier soldering and better performance in surface-mount applications.

Terminal Pitch: 0.65 mm

A smaller terminal pitch allows for denser layouts, beneficial for high-concentration circuit designs.

Maximum Supply Voltage (Vsup): 5.5 V

The ability to operate at a maximum supply voltage of 5.5V provides flexibility in circuit design and power supply options.

Technical Specifications

Logic Gates 74V1G02CTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

74V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

11.5 ns

Propagation Delay (tpd):

11.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

74V1G02CTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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