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SN74LVC1G17DBVTG4

Texas Instruments

SN74LVC1G17DBVTG4 by Texas Instruments

SN74LVC1G17DBVTG4 by Texas Instruments is a CMOS logic gate with 5.5 ns propagation delay, suitable for automotive applications. It operates at a nominal voltage of 3.3V and has a load capacitance of 50 pF. With Schmitt Trigger technology, it offers fast response times in a small outline package ideal for surface mount designs.

Median Price

$1.068

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 246,749 parts In-Stock

1+ parts

$0.806

100+ parts

$0.548

1k+ parts

$0.281

10k+ parts

-

246,749

$0.806

$0.548

$0.281

-

Mouser Electronics

USA . 107 parts In-Stock

1+ parts

$1.330

100+ parts

$0.780

1k+ parts

$0.542

10k+ parts

$0.540

107

$1.330

$0.780

$0.542

$0.540

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$0.281

100+ parts

-

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-

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50

$0.281

-

-

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Digiode

USA . 3,179 parts In-Stock

1+ parts

$0.766

100+ parts

-

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3,179

$0.766

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-

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Bristol Electronics

USA . 240 parts In-Stock

1+ parts

$0.938

100+ parts

$0.347

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-

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240

$0.938

$0.347

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Chip Stock

USA . 196,330 parts In-Stock

1+ parts

-

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196,330

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Vyrian

USA . 5,347 parts In-Stock

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-

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5,347

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Connector Distribution Corp

USA . 2,900 parts In-Stock

1+ parts

-

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2,900

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Right Parts Inc.

USA . 2,900 parts In-Stock

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-

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2,900

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 4,015 parts In-Stock

1+ parts

$0.281

100+ parts

-

1k+ parts

-

10k+ parts

$0.275

4,015

$0.281

-

-

$0.275

Argo Parts USA

USA . 543 parts In-Stock

1+ parts

$0.281

100+ parts

-

1k+ parts

-

10k+ parts

$0.273

543

$0.281

-

-

$0.273

Corohmni

South Africa . 543 parts In-Stock

1+ parts

$0.281

100+ parts

-

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-

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543

$0.281

-

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Bastille Electronics

Australia . 200 parts In-Stock

1+ parts

$0.281

100+ parts

$0.267

1k+ parts

$0.254

10k+ parts

$0.250

200

$0.281

$0.267

$0.254

$0.250

Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$0.289

100+ parts

$0.275

1k+ parts

$0.275

10k+ parts

-

100

$0.289

$0.275

$0.275

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Ampacity Inc.

Singapore . 123,231 parts In-Stock

1+ parts

$0.690

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123,231

$0.690

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Semicontronic

India . 123,075 parts In-Stock

1+ parts

$0.690

100+ parts

$0.673

1k+ parts

$0.669

10k+ parts

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123,075

$0.690

$0.673

$0.669

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Corphita

USA . 3,104 parts In-Stock

1+ parts

$0.725

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3,104

$0.725

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Parana Technologies

USA . 513 parts In-Stock

1+ parts

$30.150

100+ parts

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$67.627

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513

$30.150

-

$67.627

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DigiPath Technology Company

USA . 2,162 parts In-Stock

1+ parts

$33.198

100+ parts

$30.543

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-

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2,162

$33.198

$30.543

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ChromeModa Solutions

Germany . 3,940 parts In-Stock

1+ parts

$33.876

100+ parts

$27.778

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3,940

$33.876

$27.778

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IDEA Electronic Components Group

UK . 1,621 parts In-Stock

1+ parts

$33.876

100+ parts

$32.182

1k+ parts

$30.488

10k+ parts

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1,621

$33.876

$32.182

$30.488

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Microchip USA

USA . 1,422 parts In-Stock

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Robosynatics

Brazil . 30 parts In-Stock

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30

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Lucentia Tech

USA . 30 parts In-Stock

1+ parts

-

100+ parts

$3.548

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$3.548

10k+ parts

$3.548

30

-

$3.548

$3.548

$3.548

Overview

Enhance your electronic designs with the SN74LVC1G17DBVTG4 by Texas Instruments, a high-quality logic gates component that offers exceptional performance and reliability. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and innovation in every product. Ideal for a wide range of applications, this logic gate provides fast propagation delay and low power consumption, making it an excellent choice for your projects. Trust Texas Instruments to deliver cutting-edge technology and unmatched value with the SN74LVC1G17DBVTG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes this product lightweight and durable, perfect for various applications.

Propagation Delay At Nominal Supply: 5.5 ns

With a low propagation delay, this logic gate ensures fast response times in signal processing, making it ideal for high-speed applications.

Surface Mount: YES

Being surface mountable allows for easy and compact installation, making it space-efficient and suitable for modern electronic designs.

Package Shape: RECTANGULAR

The rectangular package shape offers versatility in mounting options and space utilization, making it convenient for different circuit layouts.

Nominal Supply Voltage / Vsup: 3.3 V

Operating at a nominal 3.3V supply voltage makes this logic gate compatible with a wide range of systems and devices.

Load Capacitance (CL): 50 pF

With a low load capacitance, this product can efficiently drive capacitive loads without compromising signal integrity.

Power Supplies (V): 3.3

Having a power supply voltage of 3.3V ensures stable and reliable operation, making it suitable for various electronic applications.

No. of Terminals: 5

The compact design with only 5 terminals simplifies installation and integration, making it user-friendly and space-saving.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

This package style offers a compact form factor with a low profile, maximizing space savings and enabling high-density circuit designs.

Maximum I (ol): 24 Amp

The high output current capability of 24A allows this logic gate to drive heavy loads with ease, making it versatile for different types of circuits.

Technical Specifications

Logic Gates SN74LVC1G17DBVTG4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

5.5 ns

Propagation Delay (tpd):

11 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.45 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.6 mm

Trade Compliance

SN74LVC1G17DBVTG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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