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SPI-240-15-T1

Onsemi

SPI-240-15-T1 by Onsemi

SPI-240-15-T1 by Onsemi is a Darlington output optoelectronic device with a max on-state voltage of 20V. It operates b/w -20 °C to 80°C, featuring a surface mounting feature and a 3mm gap size. Ideal for applications requiring high voltage switching in various electronic circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 2,472 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 1,500 parts In-Stock

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Digiode

USA . 706 parts In-Stock

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SupplyDigital Components

Austria . 7,691 parts In-Stock

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Kulean Microsystems

USA . 6,100 parts In-Stock

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Perfect Parts

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TANS Electronics

Latvia . 2,658 parts In-Stock

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Problanco Electronics

Mexico . 1,671 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 1,500 parts In-Stock

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Corphita

USA . 1,360 parts In-Stock

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Glotronic Ltd.

UK . 1,200 parts In-Stock

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UHIMA Technologies

Türkiye . 728 parts In-Stock

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Corohmni

South Africa . 355 parts In-Stock

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Overview

Enhance your optoelectronic applications with the SPI-240-15-T1 by Onsemi. Known for their top-notch quality and reliability, Onsemi delivers cutting-edge solutions for various industries. This versatile product offers a wide range of applications and benefits, providing customers with exceptional value and performance. Whether you're looking to improve efficiency or enhance functionality, the SPI-240-15-T1 is the perfect choice for all your optoelectronic needs. Trust in Onsemi to deliver excellence every time.

Feature Benefit Bullets

Maximum On State Voltage: 20 V

The high maximum on state voltage of 20 V ensures that this product can handle a wide range of input voltages, making it versatile and suitable for various applications.

Output Circuit Type: Darlington

The Darlington output circuit type provides high current gain and fast switching speeds, making this product ideal for applications requiring efficient and reliable performance.

Maximum Operating Temperature: 80 °C

With a maximum operating temperature of 80 °C, this product can withstand high temperatures without compromising its functionality, making it suitable for use in challenging environments.

Minimum Operating Temperature: -20 °C

The low minimum operating temperature of -20 °C ensures that this product can operate effectively even in cold conditions, offering reliability and performance in a wide range of temperature settings.

Mounting Feature: SURFACE MOUNT

The surface mounting feature allows for easy and convenient installation of this product on printed circuit boards, saving space and simplifying the assembly process.

Gap Size: 3 mm

The gap size of 3 mm provides ample space for proper insulation and heat dissipation, ensuring the safety and longevity of this product during operation.

Technical Specifications

Other Function Optoelectronics SPI-240-15-T1 attributes and parameters. Explore more Other Function Optoelectronics devices from Onsemi

Specs

Gap Size:

3 mm

Mounting Feature:

Maximum On State Voltage:

20 V

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-20 Cel

Output Circuit Type:

Darlington

Sub-Category:

Other Optoelectronics

Trade Compliance

SPI-240-15-T1 Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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