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SLP382F51

Onsemi

SLP382F51 by Onsemi

SLP382F51 by Onsemi is a WATER CLEAR lens optoelectronic component with peak wavelength of 565nm. It operates b/w -25 °C to 80°C, emitting green light at 2.8V forward voltage. Ideal for applications requiring precise color output in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,179 parts In-Stock

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Digiode

USA . 1,403 parts In-Stock

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1,403

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Distributors (Availability)

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Problanco Electronics

Mexico . 6,693 parts In-Stock

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6,693

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SupplyDigital Components

Austria . 4,864 parts In-Stock

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TANS Electronics

Latvia . 4,258 parts In-Stock

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Kulean Microsystems

USA . 1,417 parts In-Stock

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UHIMA Technologies

Türkiye . 583 parts In-Stock

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583

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Corphita

USA . 259 parts In-Stock

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Corohmni

South Africa . 229 parts In-Stock

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Overview

Experience the unmatched quality and reliability of Onsemi with the SLP382F51. This innovative product offers a versatile solution for a wide range of applications in the field of optoelectronics, providing exceptional value and performance to customers. With a peak wavelength of 565nm and a water-clear lens type, this product ensures optimal efficiency and precision. Trust Onsemi for cutting-edge technology and superior functionality that will elevate your projects to new heights.

Feature Benefit Bullets

Peak Wavelength: 565 nm

The peak wavelength of 565 nm makes this product ideal for applications that require a specific green color output, ensuring accurate and consistent performance.

Lens Type: WATER CLEAR

The water-clear lens type allows for maximum light transmission, resulting in bright and clear illumination for enhanced visibility in various optoelectronic applications.

Maximum Operating Temperature: 80 °C

With a high maximum operating temperature of 80 °C, this product is suitable for use in environments with elevated temperatures, ensuring reliable performance under challenging conditions.

Height: 6 mm

The compact height of 6 mm makes this product versatile and easy to integrate into different devices or systems without taking up much space, ideal for applications where size constraints are a concern.

Minimum Operating Temperature: -25 °C

The low minimum operating temperature of -25 °C ensures that this product can operate effectively in cold environments, making it suitable for a wide range of applications regardless of temperature variations.

Color At Wavelength: Green

The specified green color output at the peak wavelength enhances the visual appeal of this product and makes it ideal for applications where green light is desired for aesthetic or functional purposes.

Maximum Forward Voltage: 2.8 V

The low maximum forward voltage of 2.8 V helps in efficient energy consumption and reduces power losses, making this product a cost-effective and energy-efficient option for various optoelectronic applications.

Technical Specifications

Other Function Optoelectronics SLP382F51 attributes and parameters. Explore more Other Function Optoelectronics devices from Onsemi

Specs

Color At Wavelength:

Green

Maximum Forward Voltage:

2.8 V

Lens Type:

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-25 Cel

Height:

6 mm

Peak Wavelength (nm):

565

Sub-Category:

Visible LEDs

Trade Compliance

SLP382F51 Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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