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SPI232

Onsemi

SPI232 by Onsemi

SPI232 by Onsemi is a transistor optoelectronic device with max on-state voltage of 20V and current of 0.008A. It operates b/w -25 °C to 80°C, with response time of 0.00001s. Ideal for applications requiring through hole mounting, such as industrial control systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

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Vyrian

USA . 539 parts In-Stock

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Digiode

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Kepictronics

USA . 7,878 parts In-Stock

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SupplyDigital Components

Austria . 7,088 parts In-Stock

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TANS Electronics

Latvia . 5,264 parts In-Stock

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Problanco Electronics

Mexico . 4,014 parts In-Stock

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Corphita

USA . 1,933 parts In-Stock

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Kulean Microsystems

USA . 1,535 parts In-Stock

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UHIMA Technologies

Türkiye . 569 parts In-Stock

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Corohmni

South Africa . 132 parts In-Stock

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Overview

Elevate your optoelectronics game with the SPI232 by Onsemi. This cutting-edge product boasts top-notch quality and reliability, thanks to its reputable manufacturer. Suitable for a wide range of applications, this transistor-based optoelectronic device offers unmatched performance and versatility. Experience seamless operation with a maximum response time of 0.00001s and a maximum on-state voltage of 20V. Whether you're in the automotive, industrial, or consumer electronics industry, the SPI232 is sure to add tremendous value to your projects. Elevate your design possibilities with Onsemi's SPI232 today!

Feature Benefit Bullets

Maximum On State Voltage: 20 V

With a maximum on state voltage of 20V, this product can handle higher voltages safely, making it suitable for a wide range of applications.

Output Circuit Type: Transistor

The use of a transistor in the output circuit allows for efficient switching and amplification of signals, providing reliable performance.

Maximum Operating Temperature: 80 °C

With a maximum operating temperature of 80 °C, this product can withstand high temperatures without compromising its functionality.

Minimum Operating Temperature: -25 °C

The ability to operate at temperatures as low as -25 °C makes this product versatile and suitable for use in various environmental conditions.

Maximum Response Time: 0.00001 s

With a maximum response time of 0.00001 seconds, this product ensures swift and accurate signal processing, making it ideal for applications that require quick reactions.

Mounting Feature: THROUGH HOLE MOUNT

The through hole mounting feature allows for easy and secure installation of the product, ensuring stability and reliability in operation.

Gap Size: 3.5 mm

The 3.5mm gap size provides adequate spacing for the components, preventing any interference or short circuits, thus enhancing the product's performance and lifespan.

Maximum On State Current: 0.008 A

With a maximum on state current of 0.008A, this product can handle moderate current flow, making it suitable for low to medium power applications.

Technical Specifications

Other Function Optoelectronics SPI232 attributes and parameters. Explore more Other Function Optoelectronics devices from Onsemi

Specs

Gap Size:

3.5 mm

Mounting Feature:

Maximum On State Current:

.008 A

Maximum On State Voltage:

20 V

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-25 Cel

Output Circuit Type:

Transistor

Maximum Response Time:

.00001 s

Sub-Category:

Other Optoelectronics

Trade Compliance

SPI232 Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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