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TLYH180P

Marktech Optoelectronics

TLYH180P by Marktech Optoelectronics

Other Optoelectronics; Lens Type: WATER CLEAR; Maximum Forward Voltage: 2.5 V; Minimum Operating Temperature: -30 Cel; Height: 9.65 mm; Peak Wavelength (nm): 590;

Median Price

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Lifecycle Status

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In-Stock Inventory

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12

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Argo Parts USA

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Aranea Global

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Technical Specifications

Other Function Optoelectronics TLYH180P attributes and parameters. Explore more Other Function Optoelectronics devices from Marktech Optoelectronics

Specs

Color At Wavelength:

Yellow

Maximum Forward Current:

.05 A

Maximum Forward Voltage:

2.5 V

Lens Type:

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Height:

9.65 mm

Peak Wavelength (nm):

590

Maximum Reverse Voltage:

4 V

Sub-Category:

Visible LEDs

Viewing Angle:

8 deg

Trade Compliance

TLYH180P Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Marktech Optoelectronics

Founded in 1985, the privately held, Marktech Optoelectronics is a well-established world-class provider of detector and emitter engineering, design, manufacturing, packaging, burn-in testing, and sorting with production facilities in the USA and Japan. Marktech’s founding members leveraged their deep knowledge of industrial markets and the technical needs of design engineers to rapidly grow and expand into many industries requiring advanced photonics devices. Today, Marktech Optoelectronics is one of the world’s leading manufacturers of UV, visible, near-infrared (NIR), and short-wavelength infrared (SWIR) emitters and photodiode detectors. The company also engineers and manufactures materials such as silicon photodetector wafers, chips, and InP epiwafers. In the infrared wavelength ranges, Marktech is a vertically integrated manufacturer growing epitaxy InP wafers, fabricating InGaAs detector and emitter chips, packaging chips, and even producing completed assemblies for some OEM customers. Marktech has leading-edge packaging capabilities with the ability to package die in molded plastic through-hole, SMD, chip-scale, TO can, chip on board (COB), and their proprietary seam-welded hermetic ATLAS package. Marktech’s advanced packaging capabilities can produce multiple die components including designs with multi-wavelength emitters, multiple detectors for broadband detection, and emitter-detector combinations.

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