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AM-30-16

Onsemi

AM-30-16 by Onsemi

AM-30-16 by Onsemi is a single optoelectronic device with 4 terminals, measuring 1.15mm in size. It operates b/w -20 °C to 85°C, suitable for surface mount applications due to its rectangular shape.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 969 parts In-Stock

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969

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Vyrian

USA . 150 parts In-Stock

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150

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 590 parts In-Stock

1+ parts

$23.421

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590

$23.421

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Northwest PG Solutions

USA . 2,120 parts In-Stock

1+ parts

$25.763

100+ parts

$23.187

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2,120

$25.763

$23.187

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TANS Electronics

Latvia . 7,474 parts In-Stock

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7,474

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SupplyDigital Components

Austria . 6,603 parts In-Stock

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6,603

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Kulean Microsystems

USA . 4,341 parts In-Stock

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4,341

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Corphita

USA . 2,076 parts In-Stock

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2,076

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UHIMA Technologies

Türkiye . 688 parts In-Stock

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688

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Problanco Electronics

Mexico . 488 parts In-Stock

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488

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Corohmni

South Africa . 323 parts In-Stock

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323

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Overview

Experience the superior quality of the AM-30-16 by Onsemi, a leading manufacturer in the field of optoelectronics. This versatile device offers countless applications and possibilities thanks to its innovative design and top-notch performance. Customers can rely on the AM-30-16 for its unmatched value, benefits, and advantages, making it an essential component for all their electronic projects. Trust in Onsemi to deliver excellence with every product, including the AM-30-16.

Feature Benefit Bullets

Configuration: SINGLE

Single configuration makes it easy to integrate into existing systems without the need for complex setups.

Size: 1.15 mm

Compact size allows for space-efficient installation and can be easily placed in small electronic devices.

Optoelectronic Type: OPTOELECTRONIC DEVICE

Being an optoelectronic device ensures efficient conversion between electrical and optical signals, making it ideal for applications requiring light detection or emission.

No. of Terminals: 4

Having 4 terminals provides flexibility in connecting the device to other components or circuits.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand heat and perform reliably in various environments.

Shape: RECTANGULAR

Rectangular shape allows for easy alignment and placement during installation.

Minimum Operating Temperature: -20 °C

A low minimum operating temperature ensures that the device can function properly even in cold conditions.

Mounting Feature: SURFACE MOUNT

Surface mount capability simplifies the assembly process and provides a secure attachment to the circuit board.

Technical Specifications

Other Function Optoelectronics AM-30-16 attributes and parameters. Explore more Other Function Optoelectronics devices from Onsemi

Specs

Configuration:

SINGLE

Mounting Feature:

No. of Terminals:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Optoelectronic Type:

Shape:

RECTANGULAR

Size:

1.15 mm

Trade Compliance

AM-30-16 Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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