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SPI237

Onsemi

SPI237 by Onsemi

SPI237 by Onsemi is an optoelectronic component with max on-state voltage of 5V, response time of 0.000005s, and max on-state current of 0.00004A. Ideal for applications requiring through hole mounting in temp range -20 °C to 80°C like sensor circuits and automation systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,091 parts In-Stock

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2,091

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Vyrian

USA . 597 parts In-Stock

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597

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Kulean Microsystems

USA . 7,775 parts In-Stock

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7,775

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Kepictronics

USA . 5,430 parts In-Stock

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5,430

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Problanco Electronics

Mexico . 4,900 parts In-Stock

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4,900

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TANS Electronics

Latvia . 3,170 parts In-Stock

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3,170

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Corphita

USA . 2,015 parts In-Stock

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2,015

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SupplyDigital Components

Austria . 1,075 parts In-Stock

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1,075

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UHIMA Technologies

Türkiye . 958 parts In-Stock

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958

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Corohmni

South Africa . 439 parts In-Stock

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439

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Overview

Discover the unparalleled quality and reliability of the SPI237 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch optoelectronics solutions that are versatile and highly efficient. The SPI237 offers exceptional value with its fast response time, wide operating temperature range, and low on-state voltage and current. Ideal for a variety of applications, this product provides customers with superior performance and peace of mind. Experience the difference with the SPI237 from Onsemi today.

Feature Benefit Bullets

Maximum On State Voltage: 5 V

The low on state voltage allows for efficient power consumption and less heat generation, making this product energy efficient.

Maximum Operating Temperature: 80 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and ensure reliable performance in various applications.

Minimum Operating Temperature: -20 °C

The low minimum operating temperature extends the usability of this product in colder environments without compromising on functionality.

Maximum Response Time: 0.000005 s

The fast response time ensures quick and accurate switching, making this product suitable for high-speed applications where precision is crucial.

Mounting Feature: THROUGH HOLE MOUNT

The through-hole mounting feature simplifies installation and provides a secure and stable connection, enhancing the overall reliability of the product.

Maximum On State Current: 0.00004 A

With a low on-state current, this product consumes minimal power while in operation, contributing to energy efficiency and cost savings.

Technical Specifications

Other Function Optoelectronics SPI237 attributes and parameters. Explore more Other Function Optoelectronics devices from Onsemi

Specs

Mounting Feature:

Maximum On State Current:

.00004 A

Maximum On State Voltage:

5 V

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-20 Cel

Maximum Response Time:

.000005 s

Sub-Category:

Other Optoelectronics

Trade Compliance

SPI237 Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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