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SLP267B90

Onsemi

SLP267B90 by Onsemi

SLP267B90 by Onsemi is a green LED array with 5 LEDs, peak wavelength of 565nm, and max forward voltage of 2.8V. Ideal for applications requiring low luminous intensity from -25 °C to 80°C operating temperature range.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,207 parts In-Stock

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Digiode

USA . 886 parts In-Stock

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Kulean Microsystems

USA . 6,611 parts In-Stock

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SupplyDigital Components

Austria . 6,552 parts In-Stock

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TANS Electronics

Latvia . 4,506 parts In-Stock

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Corphita

USA . 753 parts In-Stock

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Problanco Electronics

Mexico . 608 parts In-Stock

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Corohmni

South Africa . 321 parts In-Stock

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UHIMA Technologies

Türkiye . 207 parts In-Stock

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Overview

Illuminate your world with the SLP267B90 by Onsemi, a top-tier manufacturer known for its superior quality and reliability. This optoelectronic marvel boasts a peak wavelength of 565nm, emitting a vibrant green light that is perfect for a multitude of applications. With a wide operating temperature range and low forward voltage, this product offers exceptional value and efficiency. Whether you're looking to enhance signage, create eye-catching displays, or add flair to your projects, the SLP267B90 delivers unmatched performance and versatility. Elevate your lighting experience today!

Feature Benefit Bullets

Peak Wavelength: 565nm

This specific wavelength of green light is ideal for applications requiring a specific color output.

Maximum Operating Temperature: 80 °C

With a high maximum operating temperature, this product can withstand heat-intensive environments without compromising performance.

Minimum Operating Temperature: -25 °C

The low minimum operating temperature allows this product to function effectively in colder conditions.

Minimum Luminous Intensity: 0.0003cd

Even with a low luminous intensity, this product can still provide a subtle and energy-efficient lighting solution.

Color At Wavelength: Green

The green color output is suitable for various applications such as signaling or indicating status.

No. of LEDs in Array: 5

The array of 5 LEDs provides a compact and concentrated light source for focused illumination.

Maximum Forward Voltage: 2.8V

The low maximum forward voltage ensures energy efficiency and helps to prolong the lifespan of the product.

Technical Specifications

Other Function Optoelectronics SLP267B90 attributes and parameters. Explore more Other Function Optoelectronics devices from Onsemi

Specs

Color At Wavelength:

Green

Maximum Forward Voltage:

2.8 V

Minimum Luminous Intensity:

.0003 cd

No. of LEDs in Array:

5

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-25 Cel

Peak Wavelength (nm):

565

Sub-Category:

Other Optoelectronics

Trade Compliance

SLP267B90 Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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