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TIL168-1

Texas Instruments

TIL168-1 by Texas Instruments

TIL168-1 by Texas Instruments is a Darlington optoelectronic device with max on-state voltage of 30V and forward current of 0.04A. It operates b/w -40°C to 80°C, has response time of 0.001s, and through-hole mounting feature. Ideal for applications requiring high current switching in industrial electronics.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,324 parts In-Stock

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Digiode

USA . 1,851 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 137 parts In-Stock

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$0.245

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$1.526

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137

$0.245

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$1.526

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ChromeModa Solutions

Germany . 3,782 parts In-Stock

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$0.275

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$0.226

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IDEA Electronic Components Group

UK . 11 parts In-Stock

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$0.275

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$0.248

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11

$0.275

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$0.248

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Ampacity Inc.

Singapore . 1,276 parts In-Stock

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$1.100

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$1.100

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One Stop Electronics

USA . 1,263 parts In-Stock

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$1.100

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$1.100

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Semicontronic

India . 225 parts In-Stock

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$3.100

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$3.022

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$3.007

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225

$3.100

$3.022

$3.007

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AZTECH Wire

Italy . 352 parts In-Stock

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$8.767

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Corphita

USA . 2,135 parts In-Stock

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DigiPath Technology Company

USA . 717 parts In-Stock

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$0.248

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717

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$0.248

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Corohmni

South Africa . 260 parts In-Stock

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Overview

Unleash the power of innovation with the TIL168-1 by Texas Instruments, a top-tier manufacturer known for delivering excellence in the field of optoelectronics. This versatile component offers unmatched quality and reliability, making it ideal for a wide range of applications. Whether you're looking to enhance your electronic projects or streamline your industrial processes, the TIL168-1 provides exceptional value with its superior performance and efficiency. Trust in Texas Instruments to bring cutting-edge technology to your fingertips and revolutionize the way you work.

Feature Benefit Bullets

Maximum On State Voltage: 30 V

High maximum on state voltage allows for reliable operation without risk of voltage overload.

Maximum Forward Current: 0.04 A

Low forward current ensures efficient power consumption and prevents overheating.

Output Circuit Type: Darlington

Darlington output circuit type offers high current gain and low saturation voltage, ideal for amplifying weak signals.

Maximum Operating Temperature: 80 °C

Wide operating temperature range allows for versatile use in various environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures functionality even in extreme cold conditions.

Maximum Response Time: 0.001 s

Fast response time enables quick reaction to input signals, making the product suitable for time-sensitive applications.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting provides secure and stable installation, minimizing the risk of disconnection or damage.

Maximum On State Current: 0.001 A

Low maximum on state current helps in reducing power consumption and heat generation, ensuring longevity of the product.

Technical Specifications

Other Function Optoelectronics TIL168-1 attributes and parameters. Explore more Other Function Optoelectronics devices from Texas Instruments

Specs

Maximum Forward Current:

.04 A

Mounting Feature:

No. of Elements:

1

Maximum On State Current:

.001 A

Maximum On State Voltage:

30 V

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-40 Cel

Output Circuit Type:

Darlington

Maximum Response Time:

.001 s

Sub-Category:

Other Optoelectronics

Trade Compliance

TIL168-1 Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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