Loading...

SPI230

Onsemi

SPI230 by Onsemi

SPI230 by Onsemi is a Transistor with 20V max on-state voltage, 0.008A max on-state current, and 0.00001s response time. Ideal for optoelectronic applications requiring through-hole mounting, operating b/w -25 °C to 80°C with a 5mm gap size.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,063 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,063

-

-

-

-

Vyrian

USA . 234 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

234

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Kepictronics

USA . 7,845 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,845

-

-

-

-

Kulean Microsystems

USA . 6,782 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,782

-

-

-

-

SupplyDigital Components

Austria . 5,645 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,645

-

-

-

-

TANS Electronics

Latvia . 3,130 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,130

-

-

-

-

Problanco Electronics

Mexico . 2,453 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,453

-

-

-

-

Corphita

USA . 1,804 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,804

-

-

-

-

Corohmni

South Africa . 346 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

346

-

-

-

-

UHIMA Technologies

Türkiye . 160 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

160

-

-

-

-

Overview

Elevate your electronic designs with the SPI230 by Onsemi, a top-tier manufacturer known for cutting-edge technology and superior quality. This versatile optoelectronics component offers a myriad of applications, from automation to communication systems. Experience seamless performance and reliability with the SPI230's fast response time and efficient transistor output circuit. Trust in Onsemi's reputation for excellence and unlock the value and benefits this product brings to your projects.

Feature Benefit Bullets

Maximum On State Voltage: 20 V

This high maximum on state voltage ensures stable performance and reliability of the optoelectronic device.

Output Circuit Type: Transistor

The transistor output circuit type allows for efficient amplification and switching capabilities in various applications.

Maximum Operating Temperature: 80 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions without compromising performance.

Minimum Operating Temperature: -25 °C

The low minimum operating temperature ensures reliable operation even in cold environments.

Maximum Response Time: 0.00001 s

The extremely fast response time enables quick and precise signal processing in time-critical applications.

Mounting Feature: THROUGH HOLE MOUNT

The through hole mounting feature provides a secure and stable installation of the optoelectronic device on a PCB.

Gap Size: 5 mm

The 5 mm gap size allows for efficient heat dissipation and prevents short circuits in the device.

Maximum On State Current: 0.008 A

The high maximum on state current capability ensures the device can handle a sufficient load without overheating or malfunctioning.

Technical Specifications

Other Function Optoelectronics SPI230 attributes and parameters. Explore more Other Function Optoelectronics devices from Onsemi

Specs

Gap Size:

5 mm

Mounting Feature:

Maximum On State Current:

.008 A

Maximum On State Voltage:

20 V

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-25 Cel

Output Circuit Type:

Transistor

Maximum Response Time:

.00001 s

Sub-Category:

Other Optoelectronics

Trade Compliance

SPI230 Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20