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5961-00-487-8852

Texas Instruments

5961-00-487-8852 by Texas Instruments

5961-00-487-8852 by Texas Instruments is an optoelectronic component with a peak wavelength of 900nm. It operates in temperatures ranging from -60°C to 125°C, dissipating up to 0.05W power. Ideal for applications requiring fast response times and low dark current, it features through-hole mounting.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,709 parts In-Stock

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Digiode

USA . 2,037 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 1,575 parts In-Stock

1+ parts

$0.054

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-

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$1.431

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1,575

$0.054

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$1.431

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ChromeModa Solutions

Germany . 4,964 parts In-Stock

1+ parts

$0.061

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$0.050

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4,964

$0.061

$0.050

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IDEA Electronic Components Group

UK . 2,209 parts In-Stock

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$0.061

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$0.055

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2,209

$0.061

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Native Components

USA . 858 parts In-Stock

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$1.875

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858

$1.875

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Northwest PG Solutions

USA . 619 parts In-Stock

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$2.062

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619

$2.062

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AZTECH Wire

Italy . 834 parts In-Stock

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$4.946

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834

$4.946

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Semicontronic

India . 1,557 parts In-Stock

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$5.100

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$4.972

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$4.947

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1,557

$5.100

$4.972

$4.947

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Ampacity Inc.

Singapore . 1,425 parts In-Stock

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$11.100

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$11.100

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One Stop Electronics

USA . 685 parts In-Stock

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$20.100

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685

$20.100

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Corphita

USA . 4,993 parts In-Stock

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DigiPath Technology Company

USA . 877 parts In-Stock

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$0.055

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Corohmni

South Africa . 415 parts In-Stock

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Overview

Enhance your optoelectronics projects with the 5961-00-487-8852 by Texas Instruments. Known for their exceptional quality and reliability, Texas Instruments offers cutting-edge technology in the field of Other Function Optoelectronics. With a peak wavelength of 900nm and a wide operating temperature range from -60°C to 125°C, this product is perfect for a variety of applications. Experience faster response times, lower power dissipation, and minimal dark current with the 5961-00-487-8852. Trust Texas Instruments to deliver superior performance and unmatched value in every project.

Feature Benefit Bullets

Peak Wavelength: 900nm

This specific peak wavelength makes this product suitable for applications where a specific wavelength is required for optimal performance.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows this product to be used in a wide range of environments without the risk of overheating.

Minimum Operating Temperature: -60 °C

The low minimum operating temperature ensures that this product can function effectively even in extremely cold conditions.

Maximum Power Dissipation: 0.05W

The low power dissipation of this product means it is energy-efficient and will not generate excessive heat during operation.

Maximum Dark Current: 25nA

The low maximum dark current ensures that the device will have minimal noise and produce accurate results in low light conditions.

Maximum Response Time: 0.000008s

The extremely fast response time of this product makes it ideal for applications where quick operation is essential.

Mounting Feature: THROUGH HOLE MOUNT

The through-hole mounting feature provides a secure and stable attachment method, making installation and maintenance easier.

Technical Specifications

Other Function Optoelectronics 5961-00-487-8852 attributes and parameters. Explore more Other Function Optoelectronics devices from Texas Instruments

Specs

Maximum Dark Current:

25 nA

Mounting Feature:

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-60 Cel

Peak Wavelength (nm):

900

Maximum Power Dissipation:

.05 W

Maximum Response Time:

.000008 s

Sub-Category:

Photo Transistors

Trade Compliance

5961-00-487-8852 Optoelectronics trade compliance attributes, and parameters.

ECCN

3A001.A.2.B

ECCN Governance

EAR

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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