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5961-01-024-4445

Texas Instruments

5961-01-024-4445 by Texas Instruments

The Texas Instruments 5961-01-024-4445 is an optoelectronic component with a max operating temp of 125°C and min operating temp of -65°C. It has a max power dissipation of 0.05W, dark current of 25nA, and response time of 8μs. Ideal for applications requiring through hole mounting in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,118 parts In-Stock

1+ parts

-

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8,118

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Digiode

USA . 531 parts In-Stock

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531

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,703 parts In-Stock

1+ parts

$0.063

100+ parts

-

1k+ parts

$1.437

10k+ parts

-

1,703

$0.063

-

$1.437

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ChromeModa Solutions

Germany . 2,727 parts In-Stock

1+ parts

$0.071

100+ parts

$0.058

1k+ parts

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2,727

$0.071

$0.058

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IDEA Electronic Components Group

UK . 682 parts In-Stock

1+ parts

$0.071

100+ parts

-

1k+ parts

$0.064

10k+ parts

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682

$0.071

-

$0.064

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Semicontronic

India . 1,205 parts In-Stock

1+ parts

$6.100

100+ parts

$5.948

1k+ parts

$5.917

10k+ parts

-

1,205

$6.100

$5.948

$5.917

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AZTECH Wire

Italy . 278 parts In-Stock

1+ parts

$10.773

100+ parts

-

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278

$10.773

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One Stop Electronics

USA . 631 parts In-Stock

1+ parts

$11.100

100+ parts

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631

$11.100

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Ampacity Inc.

Singapore . 1,375 parts In-Stock

1+ parts

$13.100

100+ parts

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1,375

$13.100

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Corphita

USA . 3,010 parts In-Stock

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3,010

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Northwest PG Solutions

USA . 2,015 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$3.959

10k+ parts

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2,015

-

-

$3.959

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DigiPath Technology Company

USA . 841 parts In-Stock

1+ parts

-

100+ parts

$0.064

1k+ parts

-

10k+ parts

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841

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$0.064

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Corohmni

South Africa . 283 parts In-Stock

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283

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Native Components

USA . 124 parts In-Stock

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100+ parts

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$3.919

10k+ parts

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124

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$3.919

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Overview

Experience unparalleled quality and reliability with the Texas Instruments 5961-01-024-4445. As a leader in optoelectronics, Texas Instruments delivers cutting-edge technology that exceeds industry standards. Ideal for a wide range of applications, this product offers exceptional performance in various environments. With a maximum operating temperature of 125°C and minimal power dissipation, customers can trust in the durability and efficiency of this optoelectronic solution. Discover the value and benefits that the Texas Instruments 5961-01-024-4445 brings to your projects today.

Feature Benefit Bullets

Maximum Operating Temperature: 125 °C

Allows for operation in high temperature environments, making the product versatile and reliable in various applications.

Minimum Operating Temperature: -65 °C

Capable of functioning in extremely low temperatures, ensuring usability in a wide range of environmental conditions.

Maximum Power Dissipation: 0.05 W

Efficient power dissipation capability, ensuring minimal energy wastage and optimal performance.

Maximum Dark Current: 25 nA

Low dark current results in better signal-to-noise ratio and accuracy, making the product suitable for high precision applications.

Maximum Response Time: 0.000008 s

Ultra-fast response time allows for quick reaction to changes, ideal for applications requiring rapid data processing.

Mounting Feature: THROUGH HOLE MOUNT

Convenient mounting feature simplifies installation and maintenance, offering ease of use for the end user.

Technical Specifications

Other Function Optoelectronics 5961-01-024-4445 attributes and parameters. Explore more Other Function Optoelectronics devices from Texas Instruments

Specs

Maximum Dark Current:

25 nA

Mounting Feature:

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-65 Cel

Maximum Power Dissipation:

.05 W

Maximum Response Time:

.000008 s

Sub-Category:

Photo Transistors

Trade Compliance

5961-01-024-4445 Optoelectronics trade compliance attributes, and parameters.

ECCN

3A001.A.2.B

ECCN Governance

EAR

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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