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PCFG75T65MQF

Onsemi

PCFG75T65MQF by Onsemi

PCFG75T65MQF by Onsemi is an N-CHANNEL IGBT for POWER CONTROL applications. With a max VCEsat of 1.9V, it operates at -55 to 175 °C and handles up to 650V/150A. This surface-mount chip has a gate-emitter voltage of 20V and gate-emitter threshold voltage of 6.4V, making it suitable for high-power systems.

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Vyrian

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Digiode

USA . 1,142 parts In-Stock

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Advanced Electronics

New Zealand . 20 parts In-Stock

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$1.358

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$1.236

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$1.114

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AZTECH Wire

Italy . 441 parts In-Stock

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$19.260

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Kulean Microsystems

USA . 7,962 parts In-Stock

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SupplyDigital Components

Austria . 7,730 parts In-Stock

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TANS Electronics

Latvia . 3,740 parts In-Stock

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Problanco Electronics

Mexico . 3,659 parts In-Stock

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Corohmni

South Africa . 323 parts In-Stock

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UHIMA Technologies

Türkiye . 271 parts In-Stock

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Corphita

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Overview

Unleash the power of innovation with the PCFG75T65MQF by Onsemi. Manufactured to the highest standards, this Insulated Gate Bipolar Transistor (IGBT) offers unparalleled performance in power control applications. With a maximum Collector-Emitter Voltage of 650V and a Maximum Collector Current of 150A, this N-CHANNEL transistor is designed for superior efficiency and reliability. Say goodbye to limitations and hello to endless possibilities with the PCFG75T65MQF from Onsemi.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower conduction losses and higher efficiency compared to P-channel IGBTs, making them a good choice for power control applications.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring reliable and efficient performance in controlling high power levels.

Surface Mount: YES

Surface mount packaging allows for easy and convenient installation on a circuit board, saving space and simplifying assembly.

Maximum VCEsat: 1.9 V

Low VCEsat reduces power dissipation and improves efficiency, making the IGBT suitable for high power applications where energy efficiency is crucial.

Package Shape: RECTANGULAR

Rectangular packages are commonly used for power electronic devices and provide good thermal conductivity for efficient heat dissipation.

Terminal Form: NO LEAD

No lead terminals eliminate the risk of solder fatigue and improve reliability in high power applications.

Package Style (Meter): UNCASED CHIP

Uncased chip packaging offers high power density and allows for integration into custom power modules for specific applications.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, the IGBT can withstand high temperature environments and provide continuous performance in harsh conditions.

Maximum Collector-Emitter Voltage: 650 V

High collector-emitter voltage rating allows the IGBT to be used in high voltage applications without the risk of breakdown.

Transistor Element Material: SILICON

Silicon-based IGBTs offer high voltage capability, fast switching speeds, and low on-state conduction losses, making them suitable for various power control applications.

Maximum Gate-Emitter Voltage: 20 V

With a high maximum gate-emitter voltage, the IGBT can withstand higher gate drive voltages for improved switching performance and reliability.

Minimum Operating Temperature: -55 °C

The IGBT can operate at low temperatures, making it versatile for use in a wide range of environments and applications.

Maximum Collector Current (IC): 150 A

High maximum collector current rating allows the IGBT to handle large currents, making it suitable for high power applications.

Maximum Gate-Emitter Threshold Voltage: 6.4 V

The low gate-emitter threshold voltage ensures efficient turn-on of the IGBT, reducing switching losses and improving overall efficiency.

Terminal Position: UPPER

Upper terminal position enables easy connection of the IGBT within a circuit layout, simplifying the design and assembly process.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) PCFG75T65MQF attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Maximum Gate-Emitter Threshold Voltage:

6.4 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUUC-N

No. of Elements:

1

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

UNCASED CHIP

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Maximum VCEsat:

1.9 V

Trade Compliance

PCFG75T65MQF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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