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PCFG75T120SQF

Onsemi

PCFG75T120SQF by Onsemi

The Onsemi PCFG75T120SQF is an N-CHANNEL IGBT for SWITCHING applications. It features a Max VCEsat of 1.95V, Max VGE of 20V, and Max VCE of 1200V. With a temperature range from -55 °C to 150°C, it's ideal for high-power electronics requiring efficient switching capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,251 parts In-Stock

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Digiode

USA . 1,117 parts In-Stock

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1,117

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TANS Electronics

Latvia . 8,249 parts In-Stock

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8,249

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Problanco Electronics

Mexico . 7,075 parts In-Stock

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SupplyDigital Components

Austria . 3,714 parts In-Stock

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Kulean Microsystems

USA . 2,528 parts In-Stock

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Corphita

USA . 567 parts In-Stock

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UHIMA Technologies

Türkiye . 208 parts In-Stock

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Corohmni

South Africa . 124 parts In-Stock

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Overview

Upgrade your power systems with the PCFG75T120SQF by Onsemi. As a leading manufacturer, Onsemi delivers top-quality Insulated Gate Bipolar Transistors (IGBT) like this N-CHANNEL single configuration for switching applications. With its square package shape and no lead terminal form, this IGBT offers reliable performance and efficient power management. Whether you're looking to enhance industrial equipment or streamline renewable energy systems, the PCFG75T120SQF provides exceptional value and benefits to meet your needs. Trust Onsemi for superior products that elevate your projects to the next level.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-Channel IGBTs typically have lower conduction losses, making them more efficient for switching applications.

Configuration: SINGLE

Single configuration IGBTs are easier to integrate into circuit designs, simplifying the overall setup.

Transistor Application: SWITCHING

Specifically designed for switching applications, ensuring reliable performance in high-frequency switching circuits.

Surface Mount: YES

Surface mount design allows for easy and secure installation on PCBs, saving space and improving thermal efficiency.

Maximum VCEsat: 1.95 V

Low VCEsat value indicates minimal conduction losses during operation, leading to higher efficiency.

Package Shape: SQUARE

Square package shape offers better thermal dissipation and mechanical stability, ideal for high-power applications.

Maximum Collector-Emitter Voltage: 1200 V

High VCE voltage rating allows for use in high-voltage applications, ensuring reliable operation under heavy loads.

Maximum Gate-Emitter Voltage: 20 V

Sufficient gate-emitter voltage tolerance prevents damage from overvoltage conditions, enhancing product longevity.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) PCFG75T120SQF attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

EMITTER

Maximum Collector-Emitter Voltage:

1200 V

Configuration:

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

S-XUUC-N3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

SQUARE

Package Style (Meter):

UNCASED CHIP

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum VCEsat:

1.95 V

Trade Compliance

PCFG75T120SQF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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