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NXH40T120L2Q1PTG

Onsemi

NXH40T120L2Q1PTG by Onsemi

NXH40T120L2Q1PTG by Onsemi is an N-CHANNEL IGBT with 1200V VCEsat, 40A IC, and 150 °C max operating temp. Ideal for power control applications due to its complex configuration and silicon material.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Digiode

USA . 1,770 parts In-Stock

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Vyrian

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Kulean Microsystems

USA . 6,919 parts In-Stock

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Problanco Electronics

Mexico . 3,945 parts In-Stock

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TANS Electronics

Latvia . 2,850 parts In-Stock

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Corphita

USA . 584 parts In-Stock

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UHIMA Technologies

Türkiye . 504 parts In-Stock

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Corohmni

South Africa . 309 parts In-Stock

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SupplyDigital Components

Austria . 224 parts In-Stock

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Overview

Unleash the power of innovation with the NXH40T120L2Q1PTG from Onsemi. As a leading manufacturer in the industry, Onsemi delivers exceptional quality and reliability in their Insulated Gate Bipolar Transistors (IGBT). Ideal for power control applications, this N-CHANNEL transistor offers a maximum VCEsat of 2.1V and can handle a maximum collector-emitter voltage of 1200V. With its complex configuration and 12 elements, this rectangular package style transistor provides customers with unparalleled performance and efficiency. Upgrade your projects with the NXH40T120L2Q1PTG and experience the cutting-edge technology that Onsemi has to offer.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs generally have lower on-state voltage drop and higher efficiency compared to P-channel IGBTs, making them a good choice for power control applications.

Configuration: COMPLEX

Complex configuration allows for advanced control and optimization of power in various applications, providing flexibility and efficiency.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, ensuring reliable and efficient performance in controlling high power loads.

Maximum VCEsat: 2.1 V

Low VCEsat results in reduced power dissipation and improved efficiency, making it suitable for high power applications that require minimal energy loss.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy integration and mounting in various electronic circuits or systems.

No. of Elements: 12

Higher number of elements provide increased capacity and capability for handling larger power loads and complex control requirements.

No. of Terminals: 44

Higher number of terminals allow for more connections and versatility in system integration and control.

Package Style (Meter): FLANGE MOUNT

Flange mount package style provides secure and stable mounting for reliable operation in power control applications.

Maximum Operating Temperature: 150 °C

High maximum operating temperature ensures reliable performance in demanding environments and applications where temperature variations may occur.

Maximum Collector-Emitter Voltage: 1200 V

High maximum collector-emitter voltage rating allows for handling large voltage requirements in power control applications.

Transistor Element Material: SILICON

Silicon material offers good thermal and electrical properties, ensuring efficient and reliable operation in power control applications.

Maximum Gate-Emitter Voltage: 20 V

High gate-emitter voltage rating provides optimal control and switching capabilities for precise power regulation.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for operation in cold environments or conditions without compromising performance.

Maximum Collector Current (IC): 40 A

High maximum collector current rating enables handling of large current loads in power control applications.

Maximum Gate-Emitter Threshold Voltage: 6.5 V

Gate-emitter threshold voltage ensures precise control and regulation of the transistor for efficient power management.

Terminal Position: UPPER

Upper terminal position facilitates easier connections and wiring in circuits or systems, enhancing installation and maintenance convenience.

Case Connection: ISOLATED

Isolated case connection provides electrical insulation and safety in high voltage applications, reducing the risk of short circuits or electrical hazards.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NXH40T120L2Q1PTG attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Configuration:

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X44

No. of Elements:

12

No. of Terminals:

44

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Maximum VCEsat:

2.1 V

Trade Compliance

NXH40T120L2Q1PTG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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