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NXH400N100H4Q2F2SG

Onsemi

NXH400N100H4Q2F2SG by Onsemi

NXH400N100H4Q2F2SG by Onsemi is an N-CHANNEL IGBT with 1000V VCEsat, 959W power dissipation, and 409A collector current. Ideal for POWER CONTROL applications due to its fast turn-off time of 619ns and high operating temperature range (-40 °C to 175°C).

Median Price

$223.450

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 26 parts In-Stock

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$178.660

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26

$178.660

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Rochester

USA . 6,180 parts In-Stock

1+ parts

$190.170

100+ parts

$178.760

1k+ parts

$167.350

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6,180

$190.170

$178.760

$167.350

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DigiKey

USA . 36 parts In-Stock

1+ parts

$210.480

100+ parts

$198.722

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36

$210.480

$198.722

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Mouser Electronics

USA . 27 parts In-Stock

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$227.120

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27

$227.120

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Newark

USA . 4 parts In-Stock

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$233.930

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4

$233.930

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Element14

Singapore . 26 parts In-Stock

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$304.300

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26

$304.300

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Verical

USA . 3,384 parts In-Stock

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$223.450

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$209.188

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3,384

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$223.450

$209.188

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,391 parts In-Stock

1+ parts

$211.185

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1,391

$211.185

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Vyrian

USA . 7,745 parts In-Stock

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Flip Electronics

USA . 36 parts In-Stock

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36

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Distributors (Availability)

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Corphita

USA . 2,028 parts In-Stock

1+ parts

$200.070

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2,028

$200.070

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Corohmni

South Africa . 207 parts In-Stock

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$211.180

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207

$211.180

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Continental Prestige Electronics

USA . 7 parts In-Stock

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$279.330

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7

$279.330

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Microchip USA

USA . 2,655 parts In-Stock

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$484.110

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$484.110

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

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15,000

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Problanco Electronics

Mexico . 7,384 parts In-Stock

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SupplyDigital Components

Austria . 3,466 parts In-Stock

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TANS Electronics

Latvia . 3,385 parts In-Stock

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Kulean Microsystems

USA . 2,113 parts In-Stock

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UHIMA Technologies

Türkiye . 683 parts In-Stock

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683

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Overview

Unlock the power of innovation with the NXH400N100H4Q2F2SG by Onsemi, a top-tier manufacturer known for producing high-quality Insulated Gate Bipolar Transistors (IGBTs). This N-CHANNEL transistor offers unparalleled performance in power control applications, boasting a maximum VCEsat of 2.3V and a maximum collector-emitter voltage of 1000V. With 4 elements and a package style of flange mount, this transistor delivers exceptional value and efficiency. Trust Onsemi to provide cutting-edge technology that pushes boundaries and drives success in your projects.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs have lower on-state voltage drop compared to P-CHANNEL, making them more efficient for power control applications.

Maximum Power Dissipation (Abs): 959 W

With a high maximum power dissipation, this IGBT can handle high power levels without overheating, ensuring reliable performance.

Maximum Collector-Emitter Voltage: 1000 V

The high collector-emitter voltage allows this IGBT to be used in high voltage applications, providing versatility in power control.

Maximum Collector Current (IC): 409 A

The high collector current rating makes this IGBT suitable for applications where high current handling is required.

Nominal Turn On Time (ton): 186 ns

The fast turn on time ensures quick switching operations, leading to efficient power control and reduced switching losses.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NXH400N100H4Q2F2SG attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1000 V

Configuration:

Maximum Gate-Emitter Threshold Voltage:

6.1 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X42

No. of Elements:

4

No. of Terminals:

42

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

619 ns

Nominal Turn On Time (ton):

186 ns

Maximum VCEsat:

2.3 V

Trade Compliance

NXH400N100H4Q2F2SG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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