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NXH400N100H4Q2F2SG-R

Onsemi

NXH400N100H4Q2F2SG-R by Onsemi

NXH400N100H4Q2F2SG-R by Onsemi is an N-CHANNEL IGBT with 4 elements, VCEsat of 2.3V, and IC of 409A. Ideal for POWER CONTROL applications, it has a toff of 619ns and ton of 186ns. Operating temperature ranges from -40 °C to 175°C.

Median Price

$308.420

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 94 parts In-Stock

1+ parts

$295.150

100+ parts

$277.440

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$259.730

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94

$295.150

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DigiKey

USA . 37 parts In-Stock

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$308.420

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37

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Mouser Electronics

USA . 24 parts In-Stock

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$353.850

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$318.950

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24

$353.850

$318.950

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Distributors (In-Stock)

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Digiode

USA . 2,116 parts In-Stock

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$292.999

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$292.999

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Vyrian

USA . 7,542 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 222 parts In-Stock

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$277.578

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222

$277.578

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Corohmni

South Africa . 355 parts In-Stock

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$308.420

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355

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Microchip USA

USA . 4,748 parts In-Stock

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$557.085

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4,748

$557.085

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TANS Electronics

Latvia . 8,373 parts In-Stock

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8,373

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Kulean Microsystems

USA . 7,439 parts In-Stock

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SupplyDigital Components

Austria . 4,146 parts In-Stock

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Problanco Electronics

Mexico . 3,071 parts In-Stock

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UHIMA Technologies

Türkiye . 985 parts In-Stock

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985

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Overview

Boost your power control capabilities with the NXH400N100H4Q2F2SG-R by Onsemi. This N-CHANNEL IGBT transistor offers superior performance and reliability, thanks to Onsemi's reputation for top-notch manufacturing. Ideal for a wide range of applications, this complex transistor provides customers with efficient power control solutions. With a maximum VCEsat of 2.3V and a maximum collector current of 409A, this transistor ensures optimal performance in various scenarios. Upgrade your power systems today with the NXH400N100H4Q2F2SG-R and experience the difference in quality and efficiency.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL polarity allows for efficient power control and performance.

Configuration: COMPLEX

COMPLEX configuration indicates advanced design and versatility in power control applications.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, ensuring optimal performance in controlling power flow.

Maximum VCEsat: 2.3 V

Low VCEsat results in minimal power loss and high efficiency in power conversion.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy integration and installation in various systems.

No. of Elements: 4

Having multiple elements enhances the overall power handling capacity and reliability of the transistor.

Nominal Turn Off Time (toff): 619 ns

Quick turn off time ensures fast response and efficient power control.

No. of Terminals: 42

Multiple terminals provide flexibility in connection options, enabling diverse applications.

Maximum Power Dissipation (Abs): 959 W

High power dissipation capability allows for handling heavy loads and high power levels.

Package Style (Meter): FLANGE MOUNT

Flange mount package style offers ease of installation and secure mounting in various systems.

Maximum Operating Temperature: 175 °C

High maximum operating temperature range ensures reliability and performance in demanding environments.

Maximum Collector-Emitter Voltage: 1000 V

High collector-emitter voltage rating enables safe operation in high voltage applications.

Transistor Element Material: SILICON

Silicon material provides high reliability, efficiency, and performance in power control applications.

Maximum Gate-Emitter Voltage: 20 V

High gate-emitter voltage rating ensures stable and efficient control of the transistor.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for operation in extreme cold conditions.

Maximum Collector Current (IC): 409 A

High collector current rating enables handling of large current loads with ease.

Maximum Gate-Emitter Threshold Voltage: 6.1 V

Low gate-emitter threshold voltage ensures efficient switching and control of the transistor.

Terminal Position: UPPER

Upper terminal position facilitates easy connection and integration in systems.

Case Connection: ISOLATED

Isolated case connection enhances safety and reliability by preventing electrical interference.

Nominal Turn On Time (ton): 186 ns

Fast turn on time allows for quick activation and efficient power control in dynamic applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NXH400N100H4Q2F2SG-R attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1000 V

Configuration:

Maximum Gate-Emitter Threshold Voltage:

6.1 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X42

No. of Elements:

4

No. of Terminals:

42

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

619 ns

Nominal Turn On Time (ton):

186 ns

Maximum VCEsat:

2.3 V

Trade Compliance

NXH400N100H4Q2F2SG-R Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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