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NXH450N65L4Q2F2S1G

Onsemi

NXH450N65L4Q2F2S1G by Onsemi

NXH450N65L4Q2F2S1G by Onsemi is an N-CHANNEL IGBT with 2 BANKS, SERIES CONNECTED configuration. It has a Max VCEsat of 2.2V and can handle up to 365W power dissipation. Ideal for POWER CONTROL applications due to its high Collector Current (IC) of 167A and low Turn Off Time (toff) of 694ns.

Median Price

$127.870

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 35 parts In-Stock

1+ parts

$127.870

100+ parts

$126.590

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35

$127.870

$126.590

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DigiKey

USA . 12 parts In-Stock

1+ parts

$127.870

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$110.766

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12

$127.870

$110.766

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Rochester

USA . 1,280 parts In-Stock

1+ parts

-

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$110.760

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$99.100

10k+ parts

$93.270

1,280

-

$110.760

$99.100

$93.270

Verical

USA . 1,280 parts In-Stock

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-

100+ parts

$138.450

1k+ parts

$123.875

10k+ parts

$116.588

1,280

-

$138.450

$123.875

$116.588

Distributors (In-Stock)

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Digiode

USA . 1,827 parts In-Stock

1+ parts

$116.916

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1,827

$116.916

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Vyrian

USA . 8,824 parts In-Stock

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8,824

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Distributors (Availability)

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Corphita

USA . 895 parts In-Stock

1+ parts

$110.763

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-

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895

$110.763

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Corohmni

South Africa . 392 parts In-Stock

1+ parts

$123.070

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392

$123.070

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Kulean Microsystems

USA . 6,765 parts In-Stock

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6,765

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SupplyDigital Components

Austria . 3,451 parts In-Stock

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Problanco Electronics

Mexico . 1,355 parts In-Stock

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UHIMA Technologies

Türkiye . 740 parts In-Stock

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740

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TANS Electronics

Latvia . 474 parts In-Stock

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GreenTree Electronics

Israel . 50 parts In-Stock

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Perfect Parts

USA . 20 parts In-Stock

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Overview

Enhance your power control applications with the NXH450N65L4Q2F2S1G from Onsemi. This high-quality N-CHANNEL IGBT boasts 2 BANKS, CENTER TAP configuration, and built-in diode and thermistor for efficient performance. With a maximum VCEsat of 2.2V and maximum operating temperature of 175 °C, this transistor offers reliability and durability. Ideal for various power control tasks, this IGBT provides customers with value, benefits, and advantages that will elevate their projects to the next level. Experience the difference with Onsemi's cutting-edge technology.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower conduction losses and higher efficiency compared to P-channel IGBTs, making them a good choice for power control applications.

Maximum VCEsat: 2.2 V

Low VCEsat reduces power dissipation and improves efficiency of the IGBT.

Maximum Power Dissipation (Abs): 365 W

High power dissipation rating allows the IGBT to handle high power applications without overheating.

Maximum Collector-Emitter Voltage: 650 V

High VCE rating ensures the IGBT can handle high voltage applications safely.

Maximum Gate-Emitter Voltage: 20 V

Higher gate-emitter voltage allows for better gate control and efficiency of the IGBT.

Maximum Collector Current (IC): 167 A

High collector current rating enables the IGBT to handle large currents, making it suitable for power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NXH450N65L4Q2F2S1G attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Maximum Gate-Emitter Threshold Voltage:

5.2 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X36

No. of Elements:

4

No. of Terminals:

36

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

694 ns

Nominal Turn On Time (ton):

211 ns

Maximum VCEsat:

2.2 V

Trade Compliance

NXH450N65L4Q2F2S1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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