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NXH450B100H4Q2F2SG

Onsemi

NXH450B100H4Q2F2SG by Onsemi

NXH450B100H4Q2F2SG by Onsemi is an N-CHANNEL IGBT with 3 BANKS, SERIES CONNECTED configuration. It has a Max VCEsat of 2.25V and a Max Collector-Emitter Voltage of 1000V, making it ideal for POWER CONTROL applications requiring high power dissipation up to 234W. With a Nominal Turn Off Time of 224ns, this RECTANGULAR package IGBT operates in temperatures ranging from -40 °C to 150°C.

Median Price

$146.330

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 36 parts In-Stock

1+ parts

$124.300

100+ parts

$116.840

1k+ parts

$109.380

10k+ parts

-

36

$124.300

$116.840

$109.380

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Farnell

UK . 26 parts In-Stock

1+ parts

$125.960

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26

$125.960

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Arrow

USA . 36 parts In-Stock

1+ parts

$142.175

100+ parts

$68.380

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-

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36

$142.175

$68.380

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DigiKey

USA . 36 parts In-Stock

1+ parts

$146.330

100+ parts

$129.883

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-

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36

$146.330

$129.883

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Newark

USA . 10 parts In-Stock

1+ parts

$150.720

100+ parts

$133.780

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-

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10

$150.720

$133.780

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Mouser Electronics

USA . 36 parts In-Stock

1+ parts

$158.750

100+ parts

$148.440

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36

$158.750

$148.440

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Element14

Singapore . 26 parts In-Stock

1+ parts

$211.540

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26

$211.540

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EBV Elektronik

Germany . 216 parts In-Stock

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216

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Chip1Stop

Japan . 36 parts In-Stock

1+ parts

-

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$212.000

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36

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$212.000

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Verical

USA . 36 parts In-Stock

1+ parts

-

100+ parts

$68.380

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36

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$68.380

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Flip Electronics (Authorized)

USA . 12 parts In-Stock

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Digiode

USA . 2,403 parts In-Stock

1+ parts

$133.808

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-

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2,403

$133.808

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NAC Semi

USA . 168 parts In-Stock

1+ parts

$351.820

100+ parts

-

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$316.640

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168

$351.820

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$316.640

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Vyrian

USA . 8,026 parts In-Stock

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8,026

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Flip Electronics

USA . 696 parts In-Stock

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TME

Poland . 216 parts In-Stock

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$164.510

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216

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$164.510

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,181 parts In-Stock

1+ parts

$126.765

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1,181

$126.765

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Corohmni

South Africa . 483 parts In-Stock

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$140.850

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483

$140.850

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Microchip USA

USA . 5,402 parts In-Stock

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$337.590

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5,402

$337.590

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SupplyDigital Components

Austria . 5,575 parts In-Stock

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5,575

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Kulean Microsystems

USA . 4,052 parts In-Stock

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Problanco Electronics

Mexico . 2,437 parts In-Stock

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UHIMA Technologies

Türkiye . 420 parts In-Stock

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420

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TANS Electronics

Latvia . 219 parts In-Stock

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Overview

Unleash the power of innovation with the NXH450B100H4Q2F2SG by Onsemi! As a leading manufacturer in the industry of Insulated Gate Bipolar Transistors (IGBT), Onsemi delivers unparalleled quality and reliability. This N-CHANNEL transistor is perfect for power control applications, offering a maximum VCEsat of 2.25V and a maximum collector-emitter voltage of 1000V. With 3 banks, series connected, center tapped design, this product provides exceptional performance and efficiency. Say goodbye to inefficiency and hello to optimized power management with the NXH450B100H4Q2F2SG by Onsemi!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL transistors typically have lower conduction losses and higher efficiency compared to P-CHANNEL transistors.

Configuration: 3 BANKS, SERIES CONNECTED, CENTER TAPPED WITH BUILT-IN DIODE AND THERMISTOR

This configuration allows for efficient power control and provides additional protection with the built-in diode and thermistor.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, ensuring reliable performance in controlling high power levels.

Maximum VCEsat: 2.25 V

Low VCEsat indicates lower power dissipation and higher efficiency in power switching applications.

Package Shape: RECTANGULAR

Rectangular package shape provides easy mounting and efficient utilization of space in circuit designs.

Nominal Turn Off Time (toff): 224 ns

Fast turn-off time allows for quick switching of the transistor, reducing switching losses and improving overall efficiency.

Maximum Power Dissipation (Abs): 234 W

High power dissipation capability ensures the transistor can handle large power levels without overheating or failing.

Package Style (Meter): FLANGE MOUNT

Flange mount package style offers mechanical stability and ease of mounting in industrial applications.

Maximum Operating Temperature: 150 °C

High maximum operating temperature allows for reliable operation in harsh environments without risking thermal damage.

Maximum Collector-Emitter Voltage: 1000 V

High maximum collector-emitter voltage rating enables the transistor to handle high voltage levels in power control applications.

Transistor Element Material: SILICON

Silicon material provides good switching characteristics and high temperature stability for reliable performance.

Maximum Gate-Emitter Voltage: 20 V

High maximum gate-emitter voltage ensures proper control and protection of the transistor during operation.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for reliable operation in cold environments without impacting performance.

Maximum Collector Current (IC): 101 A

High maximum collector current rating enables the transistor to handle large current levels in power control applications.

Maximum Gate-Emitter Threshold Voltage: 5.7 V

Appropriate gate-emitter threshold voltage ensures proper turn-on and turn-off of the transistor for efficient power control.

Terminal Position: UPPER

Upper terminal position facilitates easier connection and routing of external wiring in circuit layouts.

Case Connection: ISOLATED

Isolated case connection provides protection against electric shock and interference in high voltage applications.

Nominal Turn On Time (ton): 42 ns

Fast turn-on time allows for quick activation of the transistor and efficient power switching in control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NXH450B100H4Q2F2SG attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1000 V

Maximum Gate-Emitter Threshold Voltage:

5.7 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X56

No. of Elements:

6

No. of Terminals:

56

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

224 ns

Nominal Turn On Time (ton):

42 ns

Maximum VCEsat:

2.25 V

Trade Compliance

NXH450B100H4Q2F2SG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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