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NVMFS5C682NLT3G

Onsemi

NVMFS5C682NLT3G by Onsemi

NVMFS5C682NLT3G by Onsemi is a N-CHANNEL FET with 60V DS Breakdown Voltage, 130A IDM, and 0.0315 ohm RDS(on). Ideal for power applications in automotive industry due to AEC-Q101 standard compliance.

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 5,946 parts In-Stock

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Digiode

USA . 1,329 parts In-Stock

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AZTECH Wire

Italy . 927 parts In-Stock

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Kepictronics

USA . 160,000 parts In-Stock

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Authorized Procurement Solutions

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QUARKTWIN TECHNOLOGY LTD

USA . 20,382 parts In-Stock

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SupplyDigital Components

Austria . 4,737 parts In-Stock

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Problanco Electronics

Mexico . 4,357 parts In-Stock

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TANS Electronics

Latvia . 1,723 parts In-Stock

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Kulean Microsystems

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Corohmni

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UHIMA Technologies

Türkiye . 402 parts In-Stock

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Corphita

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Overview

Discover the ultimate power solution with the NVMFS5C682NLT3G by Onsemi. Crafted with precision and expertise, this Power FET offers unparalleled performance and reliability for a wide range of applications. From enhancing efficiency in automotive systems to optimizing power management in industrial equipment, this N-CHANNEL transistor is designed to exceed expectations. With a focus on quality and innovation, Onsemi delivers a product that not only meets but exceeds industry standards. Experience the value and benefits of the NVMFS5C682NLT3G and take your projects to new heights. Elevate your power solutions with Onsemi today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the FET, making it suitable for various environments and applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance characteristics and higher efficiency compared to P-channel FETs, making this product a good choice for power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for improved performance and reliability in circuit designs that require this feature.

Surface Mount: YES

Being surface mountable makes this FET easy to integrate into PCB designs, saving space and simplifying assembly processes.

Minimum DS Breakdown Voltage: 60 V

The high breakdown voltage ensures reliable operation and protection against voltage spikes or surges in the circuit.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer better control and efficiency in switching applications, making this product suitable for power management systems.

Maximum Pulsed Drain Current (IDM): 130 A

The high pulsed drain current rating allows for handling high current spikes or surges without compromising the performance of the FET.

Maximum Power Dissipation (Abs): 28 W

With a high power dissipation rating, this FET can handle large power loads without overheating, ensuring reliable operation in demanding conditions.

Maximum Operating Temperature: 175 °C

The high operating temperature range makes this FET suitable for use in applications where temperature fluctuations or high temperatures are common.

Maximum Drain-Source On Resistance: 0.0315 ohm

The low on-resistance of the FET results in reduced power losses and improved efficiency in power delivery applications.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS5C682NLT3G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

43 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

25 A

Maximum Drain Current (ID):

25 A

Maximum Drain-Source On Resistance:

.0315 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

130 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVMFS5C682NLT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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