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NVH4L110N65S3F

Onsemi

NVH4L110N65S3F by Onsemi

NVH4L110N65S3F by Onsemi is a N-CHANNEL Power FET with 650V DS Breakdown Voltage and 69A IDM. Ideal for applications requiring high power dissipation up to 240W, such as automotive systems due to AEC-Q101 standard compliance.

Median Price

$7.490

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 410 parts In-Stock

1+ parts

$7.490

100+ parts

$3.650

1k+ parts

$3.620

10k+ parts

-

410

$7.490

$3.650

$3.620

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DigiKey

USA . 403 parts In-Stock

1+ parts

$7.520

100+ parts

$4.346

1k+ parts

$3.160

10k+ parts

-

403

$7.520

$4.346

$3.160

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Chip1Stop

Japan . 318 parts In-Stock

1+ parts

$20.300

100+ parts

$8.980

1k+ parts

-

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318

$20.300

$8.980

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Rochester

USA . 6,777 parts In-Stock

1+ parts

-

100+ parts

$3.160

1k+ parts

$2.830

10k+ parts

$2.660

6,777

-

$3.160

$2.830

$2.660

Verical

USA . 6,777 parts In-Stock

1+ parts

-

100+ parts

$3.950

1k+ parts

$3.538

10k+ parts

$3.325

6,777

-

$3.950

$3.538

$3.325

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,348 parts In-Stock

1+ parts

$3.334

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-

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1,348

$3.334

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Vyrian

USA . 10,494 parts In-Stock

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10,494

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Flip Electronics

USA . 900 parts In-Stock

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900

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Distributors (Availability)

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Corphita

USA . 199 parts In-Stock

1+ parts

$3.159

100+ parts

-

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199

$3.159

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-

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Corohmni

South Africa . 283 parts In-Stock

1+ parts

$3.510

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283

$3.510

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Component Stockers USA

USA . 282 parts In-Stock

1+ parts

$8.640

100+ parts

$5.520

1k+ parts

-

10k+ parts

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282

$8.640

$5.520

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Microchip USA

USA . 4,207 parts In-Stock

1+ parts

$26.849

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4,207

$26.849

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QUARKTWIN TECHNOLOGY LTD

USA . 26,434 parts In-Stock

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26,434

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SupplyDigital Components

Austria . 7,370 parts In-Stock

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7,370

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Problanco Electronics

Mexico . 5,164 parts In-Stock

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Kulean Microsystems

USA . 2,731 parts In-Stock

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2,731

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Perfect Parts

USA . 1,360 parts In-Stock

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1,360

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TANS Electronics

Latvia . 752 parts In-Stock

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752

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GreenTree Electronics

Israel . 438 parts In-Stock

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438

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iodParts Technologies Inc.

India . 318 parts In-Stock

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318

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UHIMA Technologies

Türkiye . 271 parts In-Stock

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271

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Overview

Discover the power of the NVH4L110N65S3F by Onsemi - a top-of-the-line Power Field Effect Transistor that guarantees reliability and efficiency. Manufactured by industry leader Onsemi, this N-CHANNEL FET with a built-in diode is designed for high-performance applications. With a maximum operating temperature of 150 °C and an impressive avalanche energy rating of 380 mJ, this transistor ensures optimal performance in any situation. Experience the benefits of enhanced power dissipation, high pulsing capabilities, and low on-resistance with the NVH4L110N65S3F - the ultimate solution for your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FET.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their high efficiency and fast switching capabilities.

Minimum DS Breakdown Voltage: 650 V

Allows for high voltage applications without risk of damage to the FET.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode adds protection and versatility to the FET's usage.

Maximum Pulsed Drain Current (IDM): 69 A

Enables the FET to handle high current transients effectively.

Avalanche Energy Rating (EAS): 380 mJ

Can withstand energy spikes without breakdown, ensuring reliability.

Maximum Power Dissipation (Abs): 240 W

Capable of dissipating high levels of power without overheating.

Maximum Operating Temperature: 150 °C

Suitable for use in environments with elevated temperatures.

Maximum Drain-Source On Resistance: 0.11 ohm

Low on-resistance leads to minimal power loss and higher efficiency.

Reference Standard: AEC-Q101

Compliance with automotive quality standards ensures reliability and performance consistency.

Technical Specifications

Power Field Effect Transistors (FET) NVH4L110N65S3F attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

380 mJ

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (ID):

30 A

Maximum Drain-Source On Resistance:

.11 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

7.5 pF

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T4

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

69 A

Reference Standard:

AEC-Q101

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Element Material:

SILICON

Trade Compliance

NVH4L110N65S3F Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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