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NVD4856NT4G

Onsemi

NVD4856NT4G by Onsemi

NVD4856NT4G by Onsemi is a Power FET with N-CHANNEL polarity, suitable for SWITCHING applications. It features a 25V DS Breakdown Voltage, 179A Max Pulsed Drain Current, and 0.0068 ohm Max Drain-Source Resistance. Ideal for high-power switching circuits in automotive and industrial electronics due to its 60W Power Dissipation capability.

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1k+

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Chip Stock

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AZTECH Wire

Italy . 874 parts In-Stock

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Component Stockers USA

USA . 268 parts In-Stock

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Kepictronics

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TANS Electronics

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Kulean Microsystems

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A-Z Elektronik GmbH

Germany . 6,168 parts In-Stock

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SupplyDigital Components

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Corphita

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Overview

Unleash the power of innovation with the NVD4856NT4G by Onsemi, a top-of-the-line Power Field Effect Transistor (FET) designed to elevate your switching applications to new heights. Crafted with precision and expertise by Onsemi, this N-channel transistor boasts a single configuration with a built-in diode, offering unparalleled performance and reliability. Ideal for a wide range of applications, this transistor is a game-changer in the industry, providing exceptional value and benefits that will exceed your expectations. Experience cutting-edge technology and unrivaled efficiency with the NVD4856NT4G - the ultimate choice for all your power needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the FET, ensuring long-lasting performance.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically have lower ON resistance and higher switching speeds, making them suitable for various switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode helps in protecting the circuit from reverse current or voltage spikes, enhancing the reliability of the FET.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers efficient and precise control over the flow of current.

Surface Mount: YES

Surface mount technology allows for easy and secure placement on PCBs, saving space and simplifying the manufacturing process.

Maximum Pulsed Drain Current (IDM): 179 A

High maximum pulsed drain current capability ensures the FET can handle sudden spikes in current without damage, making it suitable for high-power applications.

Maximum Power Dissipation (Abs): 60 W

With a high power dissipation rating, this FET can handle heat dissipation effectively, ensuring stable operation under heavy load conditions.

Maximum Operating Temperature: 175 °C

High maximum operating temperature tolerance allows the FET to operate reliably in demanding environments without overheating.

Technical Specifications

Power Field Effect Transistors (FET) NVD4856NT4G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

180.5 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

25 V

Maximum Drain Current (Abs) (ID):

89 A

Maximum Drain Current (ID):

13.3 A

Maximum Drain-Source On Resistance:

.0068 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

179 A

Reference Standard:

AEC-Q101

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NVD4856NT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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