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NVD4805NT4G

Onsemi

NVD4805NT4G by Onsemi

NVD4805NT4G by Onsemi is a Power FET with N-CHANNEL polarity, suitable for SWITCHING applications. It features a 30V DS Breakdown Voltage, 175A Max Pulsed Drain Current, and 0.0074 ohm Max RDS(on). Ideal for high-power switching circuits in automotive and industrial electronics due to its AEC-Q101 compliance.

Median Price

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Lifecycle Status

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3

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1k+

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Chip Stock

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Vyrian

USA . 12,094 parts In-Stock

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Digiode

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AZTECH Wire

Italy . 112 parts In-Stock

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Kepictronics

USA . 13,000 parts In-Stock

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Kulean Microsystems

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Problanco Electronics

Mexico . 5,068 parts In-Stock

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Metaverse IC Inc.

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TANS Electronics

Latvia . 4,636 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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SupplyDigital Components

Austria . 2,416 parts In-Stock

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South Africa . 297 parts In-Stock

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Overview

Experience the power of innovation with the NVD4805NT4G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors for a wide range of applications. With a focus on reliability and performance, this N-channel transistor boasts a single configuration with a built-in diode, perfect for switching tasks. Its small outline package and high operating temperature make it ideal for demanding environments. Trust Onsemi to provide cutting-edge technology that ensures maximum efficiency and durability. Upgrade your projects today with the NVD4805NT4G and experience the difference.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protects the internal components from external elements, making the product long-lasting.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have higher electron mobility, allowing for faster switching speeds and lower power consumption.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for more efficient power handling and protection against reverse voltage.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient and reliable performance.

Maximum Pulsed Drain Current (IDM): 175 A

With a high pulsed drain current rating, this FET can handle sudden surges in power without damage.

Maximum Drain Current (Abs) (ID): 95 A

The high drain current rating allows for ample power handling capacity in various applications.

Avalanche Energy Rating (EAS): 288 mJ

The high avalanche energy rating ensures the FET can handle sudden voltage spikes without breakdown.

Maximum Power Dissipation (Abs): 79 W

With a high power dissipation rating, this FET can effectively transfer and dissipate heat, ensuring reliable operation.

Maximum Operating Temperature: 175 °C

The high operating temperature range allows for operation in a wide range of environments without performance degradation.

Maximum Drain-Source On Resistance: 0.0074 ohm

Low on-resistance ensures minimal power losses and efficient power handling capabilities.

Technical Specifications

Power Field Effect Transistors (FET) NVD4805NT4G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

288 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

95 A

Maximum Drain Current (ID):

12.7 A

Maximum Drain-Source On Resistance:

.0074 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

175 A

Reference Standard:

AEC-Q101

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NVD4805NT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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