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NVD4806NT4G-VF01

Onsemi

NVD4806NT4G-VF01 by Onsemi

NVD4806NT4G-VF01 by Onsemi is a Power FET with 30V DS Breakdown Voltage, 150A IDM, and 220mJ EAS. Ideal for SWITCHING applications, it features N-CHANNEL polarity, SINGLE configuration with built-in DIODE, and operates in ENHANCEMENT MODE.

Median Price

$0.462

Lifecycle Status

EOL

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

$0.445

1k+ parts

$0.369

10k+ parts

$0.329

2,500

-

$0.445

$0.369

$0.329

DigiKey

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

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$0.560

10k+ parts

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2,500

-

-

$0.560

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Verical

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

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$0.462

10k+ parts

$0.411

2,500

-

-

$0.462

$0.411

Distributors (In-Stock)

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Vyrian

USA . 2,064 parts In-Stock

1+ parts

$0.350

100+ parts

-

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2,064

$0.350

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Digiode

USA . 293 parts In-Stock

1+ parts

$0.383

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293

$0.383

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Distributors (Availability)

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Corohmni

South Africa . 434 parts In-Stock

1+ parts

$0.350

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434

$0.350

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Corphita

USA . 781 parts In-Stock

1+ parts

$0.363

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781

$0.363

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Component Stockers USA

USA . 3,544 parts In-Stock

1+ parts

$0.410

100+ parts

$0.390

1k+ parts

$0.350

10k+ parts

-

3,544

$0.410

$0.390

$0.350

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Problanco Electronics

Mexico . 7,403 parts In-Stock

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7,403

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Kulean Microsystems

USA . 4,871 parts In-Stock

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4,871

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Continental Prestige Electronics

USA . 2,500 parts In-Stock

1+ parts

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100+ parts

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$0.369

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2,500

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$0.369

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TANS Electronics

Latvia . 699 parts In-Stock

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699

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UHIMA Technologies

Türkiye . 276 parts In-Stock

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SupplyDigital Components

Austria . 186 parts In-Stock

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Overview

Experience the superior performance and reliability of the NVD4806NT4G-VF01 by Onsemi, a top-of-the-line power field effect transistor (FET) designed for switching applications. With its high-quality construction and innovative technology, this single-channel FET with built-in diode offers unmatched value and benefits to customers. Whether you're looking to enhance your electronic devices or improve power efficiency, this product delivers exceptional results. Trust in Onsemi's reputation for excellence and elevate your projects with the NVD4806NT4G-VF01.

Feature Benefit Bullets

Package Body Material PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection for the internal components of the power FET.

Polarity or Channel Type N-CHANNEL

N-channel FETs typically have lower ON resistance and higher efficiency compared to P-channel FETs, making them a good choice for switching applications.

Configuration SINGLE WITH BUILT-IN DIODE

The built-in diode allows for improved efficiency in switching operations and protects the circuit from reverse voltage spikes.

Transistor Application SWITCHING

Designed specifically for switching applications, ensuring optimal performance and reliability in power control circuits.

Surface Mount YES

The surface mount capability allows for easy and convenient mounting on circuit boards, saving space and simplifying assembly.

Minimum DS Breakdown Voltage 30 V

The minimum breakdown voltage of 30V ensures reliable operation and protection against voltage spikes in the circuit.

Operating Mode ENHANCEMENT MODE

Enhancement mode transistors offer better control and higher efficiency in power switching applications.

Maximum Pulsed Drain Current (IDM) 150 A

The high pulsed drain current capability of 150A allows for handling large current spikes effectively, suitable for demanding applications.

Avalanche Energy Rating (EAS) 220 mJ

The high avalanche energy rating ensures robustness and reliability in the face of voltage fluctuations or transients.

Maximum Drain Current (Abs) (ID) 45 A

The maximum drain current of 45A allows for continuous operation at high current levels without risk of damage.

Maximum Power Dissipation (Abs) 68 W

With a maximum power dissipation of 68W, this FET is capable of handling high power levels efficiently, making it suitable for demanding applications.

Maximum Operating Temperature 175 °C

The high maximum operating temperature of 175 °C ensures reliable performance even in high-temperature environments.

Minimum Operating Temperature -55 °C

The low minimum operating temperature of -55C allows for operation in a wide range of temperature conditions, making it versatile and robust.

Maximum Drain Current (ID) 11.3 A

The high maximum drain current of 11.3A ensures reliable performance under heavy load conditions.

Maximum Drain-Source On Resistance 0.0094 ohm

The low drain-source on resistance allows for efficient power transfer and minimal power loss in the circuit.

Maximum Feedback Capacitance (Crss) 251 pF

The low feedback capacitance helps in reducing switching losses and improving overall efficiency in the circuit.

Reference Standard AEC-Q101

Compliance with the AEC-Q101 standard ensures high reliability and quality, making it suitable for automotive applications or other demanding environments.

Technical Specifications

Power Field Effect Transistors (FET) NVD4806NT4G-VF01 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

220 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

45 A

Maximum Drain Current (ID):

11.3 A

Maximum Drain-Source On Resistance:

.0094 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

251 pF

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

150 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NVD4806NT4G-VF01 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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