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NVD4809NHT4G

Onsemi

NVD4809NHT4G by Onsemi

NVD4809NHT4G by Onsemi is a N-CHANNEL FET with 58A max drain current and 52W power dissipation. Ideal for high-power applications, it operates up to 175 °C, making it suitable for industrial use in surface-mount configurations.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,452 parts In-Stock

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Vyrian

USA . 1,114 parts In-Stock

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Kepictronics

USA . 15,000 parts In-Stock

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15,000

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Problanco Electronics

Mexico . 3,800 parts In-Stock

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Corphita

USA . 2,485 parts In-Stock

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Kulean Microsystems

USA . 1,451 parts In-Stock

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Perfect Parts

USA . 560 parts In-Stock

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560

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SupplyDigital Components

Austria . 276 parts In-Stock

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UHIMA Technologies

Türkiye . 236 parts In-Stock

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Corohmni

South Africa . 99 parts In-Stock

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TANS Electronics

Latvia . 15 parts In-Stock

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Overview

Elevate your power management with the NVD4809NHT4G by Onsemi. Crafted with precision and reliability, this N-CHANNEL Power Field Effect Transistor offers unparalleled performance in a variety of applications. From industrial to automotive, this FET delivers a seamless experience with its maximum drain current of 58A and 52W power dissipation. Trust in Onsemi's expertise to provide you with the quality and value you deserve. Experience the difference with the NVD4809NHT4G.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs generally have better performance and efficiency compared to P-CHANNEL FETs, making this product a good choice for applications requiring high performance.

Configuration: SINGLE

Single configuration FETs are easier to manage and control, making this product a good choice for simpler circuit designs.

Surface Mount: YES

Surface mount capability allows for easier and more compact PCB design, making this product a good choice for space-constrained applications.

Maximum Drain Current (Abs) (ID): 58 A

High maximum drain current allows for handling larger loads and higher power applications, making this product a good choice for high-power circuits.

Maximum Power Dissipation (Abs): 52 W

High maximum power dissipation capability ensures the FET can handle heat generated during operation, making this product a good choice for reliable operation under heavy loads.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-Oxide Semiconductor FETs are known for their high switching speeds and low power consumption, making this product a good choice for applications requiring efficiency and fast response times.

Maximum Operating Temperature: 175 °C

High maximum operating temperature tolerance ensures reliable operation in high-temperature environments, making this product a good choice for industrial or automotive applications.

Terminal Finish: Tin (Sn)

Tin terminal finish provides good solderability and corrosion resistance, making this product a good choice for long-term reliability in various operating conditions.

Technical Specifications

Power Field Effect Transistors (FET) NVD4809NHT4G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

58 A

Maximum Drain Current (ID):

58 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Maximum Operating Temperature:

175 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Tin (Sn)

Trade Compliance

NVD4809NHT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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