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NVD4806NT4G

Onsemi

NVD4806NT4G by Onsemi

NVD4806NT4G by Onsemi is an N-CHANNEL FET with 79A max drain current and 68W max power dissipation. Ideal for high-power applications, it operates up to 175 °C, making it suitable for demanding environments requiring efficient power management in a compact surface-mount configuration.

Median Price

$0.462

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 38,679 parts In-Stock

1+ parts

-

100+ parts

$0.445

1k+ parts

$0.369

10k+ parts

$0.329

38,679

-

$0.445

$0.369

$0.329

DigiKey

USA . 38,679 parts In-Stock

1+ parts

-

100+ parts

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$0.560

10k+ parts

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38,679

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-

$0.560

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Verical

USA . 30,000 parts In-Stock

1+ parts

-

100+ parts

-

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$0.462

10k+ parts

$0.411

30,000

-

-

$0.462

$0.411

Flip Electronics (Authorized)

USA . 2,500 parts In-Stock

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2,500

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Distributors (In-Stock)

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Vyrian

USA . 2,354 parts In-Stock

1+ parts

$0.278

100+ parts

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2,354

$0.278

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Digiode

USA . 2,377 parts In-Stock

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$0.350

100+ parts

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2,377

$0.350

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Chip Stock

USA . 34,000 parts In-Stock

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34,000

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Flip Electronics

USA . 2,500 parts In-Stock

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2,500

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 68 parts In-Stock

1+ parts

$0.278

100+ parts

-

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68

$0.278

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Corphita

USA . 262 parts In-Stock

1+ parts

$0.331

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262

$0.331

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Continental Prestige Electronics

USA . 38,679 parts In-Stock

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100+ parts

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$0.291

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38,679

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$0.291

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Kepictronics

USA . 13,000 parts In-Stock

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Kulean Microsystems

USA . 7,771 parts In-Stock

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7,771

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SupplyDigital Components

Austria . 7,692 parts In-Stock

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7,692

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TANS Electronics

Latvia . 6,039 parts In-Stock

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6,039

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

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6,000

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Problanco Electronics

Mexico . 2,713 parts In-Stock

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2,713

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UHIMA Technologies

Türkiye . 584 parts In-Stock

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584

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Overview

Unlock the power of efficiency and reliability with the NVD4806NT4G by Onsemi. As a leading manufacturer in Power Field Effect Transistors, Onsemi delivers top-quality products that exceed expectations. The N-CHANNEL configuration and 79A maximum drain current make this FET ideal for a wide range of applications. Experience the value and benefits of enhanced performance and durability with the NVD4806NT4G, providing customers with the advantage they need to succeed in their projects.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs offer higher electron mobility and faster operation compared to P-CHANNEL FETs, making this product suitable for high-speed applications.

Configuration: SINGLE

The SINGLE configuration simplifies the circuit design and reduces the component count, making this product more cost-effective and easy to integrate.

Surface Mount: YES

Surface mount packaging allows for compact and space-saving designs, ideal for applications with limited space or where weight is a concern.

Maximum Drain Current (Abs) (ID): 79 A

With a high maximum drain current rating, this FET can handle large current loads, making it suitable for power applications that require high current handling capability.

Maximum Power Dissipation (Abs): 68 W

The high power dissipation rating allows the FET to withstand high power levels without overheating, ensuring reliable performance in demanding environments.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers low ON resistance and high switching speeds, making this FET efficient and fast in operation.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, this FET can withstand elevated temperatures, making it suitable for harsh operating conditions.

Terminal Finish: TIN

Tin terminal finish provides good solderability and corrosion resistance, ensuring reliable connections and long-term performance.

Technical Specifications

Power Field Effect Transistors (FET) NVD4806NT4G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

79 A

Maximum Drain Current (ID):

79 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Maximum Operating Temperature:

175 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Trade Compliance

NVD4806NT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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