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NVD4813NHT4G

Onsemi

NVD4813NHT4G by Onsemi

NVD4813NHT4G by Onsemi is a single N-CHANNEL FET with 40A max drain current and 35.3W power dissipation. Ideal for high-power applications, it operates up to 175 °C, making it suitable for various industrial uses requiring robust performance in surface-mount configurations.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Chip Stock

USA . 80,000 parts In-Stock

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Vyrian

USA . 1,307 parts In-Stock

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Digiode

USA . 1,102 parts In-Stock

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Perfect Parts

USA . 23,367 parts In-Stock

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Kepictronics

USA . 13,000 parts In-Stock

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Kulean Microsystems

USA . 5,056 parts In-Stock

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TANS Electronics

Latvia . 4,117 parts In-Stock

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SupplyDigital Components

Austria . 2,562 parts In-Stock

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Corphita

USA . 675 parts In-Stock

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Problanco Electronics

Mexico . 354 parts In-Stock

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Corohmni

South Africa . 290 parts In-Stock

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UHIMA Technologies

Türkiye . 82 parts In-Stock

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Overview

Unleash the power of innovation with the NVD4813NHT4G by Onsemi. Crafted with precision and expertise, this N-CHANNEL Power Field Effect Transistor offers unparalleled performance and reliability. Whether you're designing industrial equipment or automotive systems, this FET is the perfect choice for your high-power applications. With a maximum drain current of 40A and a maximum power dissipation of 35.3W, this transistor ensures optimal efficiency and durability. Elevate your projects with Onsemi's cutting-edge technology and redefine what's possible in the world of electronics.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs generally have higher mobility and conductivity compared to P-CHANNEL FETs, making them ideal for high-power applications.

Configuration: SINGLE

Single configuration FETs are simpler to use and provide consistent performance, making them suitable for various applications.

Surface Mount: YES

Surface mount FETs are compact and easy to mount on PCBs, saving space and simplifying assembly processes.

Maximum Drain Current (Abs) (ID): 40 A

With a high maximum drain current, this FET can handle heavy loads and is suitable for high-power applications.

Maximum Power Dissipation (Abs): 35.3 W

The high maximum power dissipation allows the FET to handle significant heat generation, ensuring reliable operation in demanding conditions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-Oxide Semiconductor FETs offer high efficiency and fast switching speeds, making them ideal for power management applications.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, this FET can withstand elevated temperatures, increasing its reliability in harsh environments.

Terminal Finish: TIN

Tin terminal finish provides good conductivity and solderability, ensuring reliable connections and easy integration into electronic circuits.

Technical Specifications

Power Field Effect Transistors (FET) NVD4813NHT4G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

40 A

Maximum Drain Current (ID):

40 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Maximum Operating Temperature:

175 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Trade Compliance

NVD4813NHT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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