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NVD4804NT4G

Onsemi

NVD4804NT4G by Onsemi

NVD4804NT4G by Onsemi is a single N-channel power FET with built-in diode for switching applications. It features a max pulsed drain current of 230A, avalanche energy rating of 450mJ, and max power dissipation of 107W. Ideal for high-power switching circuits in automotive and industrial electronics due to its robust design and enhanced performance capabilities.

Median Price

$0.664

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 12,500 parts In-Stock

1+ parts

-

100+ parts

$0.640

1k+ parts

$0.531

10k+ parts

$0.474

12,500

-

$0.640

$0.531

$0.474

DigiKey

USA . 12,500 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$0.800

10k+ parts

-

12,500

-

-

$0.800

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Verical

USA . 12,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.664

10k+ parts

$0.592

12,500

-

-

$0.664

$0.592

Distributors (In-Stock)

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Digiode

USA . 1,705 parts In-Stock

1+ parts

$0.494

100+ parts

-

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1,705

$0.494

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Chip Stock

USA . 19,000 parts In-Stock

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Vyrian

USA . 4,483 parts In-Stock

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4,483

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Bristol Electronics

USA . 25 parts In-Stock

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25

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Distributors (Availability)

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Corphita

USA . 682 parts In-Stock

1+ parts

$0.468

100+ parts

-

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682

$0.468

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Corohmni

South Africa . 379 parts In-Stock

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$0.520

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-

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379

$0.520

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AZTECH Wire

Italy . 546 parts In-Stock

1+ parts

$13.780

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546

$13.780

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Kepictronics

USA . 13,000 parts In-Stock

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13,000

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Continental Prestige Electronics

USA . 12,500 parts In-Stock

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$0.477

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12,500

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$0.477

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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SupplyDigital Components

Austria . 7,766 parts In-Stock

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7,766

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Kulean Microsystems

USA . 6,679 parts In-Stock

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6,679

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A-Z Elektronik GmbH

Germany . 6,029 parts In-Stock

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Problanco Electronics

Mexico . 5,620 parts In-Stock

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Perfect Parts

USA . 5,005 parts In-Stock

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TANS Electronics

Latvia . 4,086 parts In-Stock

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RC Electronics

USA . 2,500 parts In-Stock

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2,500

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UHIMA Technologies

Türkiye . 564 parts In-Stock

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564

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Benley Electronics

USA . 490 parts In-Stock

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490

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Overview

Unleash the power of innovation with the NVD4804NT4G by Onsemi! Crafted with precision and expertise, this Power Field Effect Transistor (FET) offers unparalleled quality and performance. Ideal for switching applications, this N-CHANNEL transistor with a built-in diode is designed to enhance efficiency and reliability. With a maximum pulsing drain current of 230A and an avalanche energy rating of 450mJ, this transistor delivers exceptional power in a compact package. Experience seamless operation and superior functionality with the NVD4804NT4G - your ultimate solution for all your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the FET, making it more resistant to environmental factors and extending its lifespan.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have higher electron mobility and lower resistance compared to P-channel FETs, resulting in better performance.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode allows for easier circuit design and helps protect against reverse currents, enhancing the overall efficiency and reliability of the FET.

Transistor Application: SWITCHING

Designed specifically for switching applications, providing fast response times and efficient power control.

Surface Mount: YES

Surface mount technology allows for easy and compact installation on circuit boards, saving space and improving overall system design.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30 V, this FET can handle higher voltages, making it suitable for a wide range of applications.

Maximum Pulsed Drain Current (IDM): 230 A

High pulsed drain current rating allows for handling of large current spikes, making it suitable for demanding applications.

Maximum Power Dissipation (Abs): 107 W

High power dissipation capability ensures the FET can handle high power levels without overheating, improving reliability.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, this FET can operate in harsh environments without compromising performance.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance, ensuring a reliable electrical connection.

Technical Specifications

Power Field Effect Transistors (FET) NVD4804NT4G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

450 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

124 A

Maximum Drain Current (ID):

14.5 A

Maximum Drain-Source On Resistance:

.0055 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

230 A

Reference Standard:

AEC-Q101

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NVD4804NT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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