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NVD4809NT4G

Onsemi

NVD4809NT4G by Onsemi

NVD4809NT4G by Onsemi is a single N-channel Power FET with 58A max drain current and 52W max power dissipation. Ideal for applications requiring high power handling in surface mount configurations, such as automotive systems or industrial equipment.

Median Price

$0.330

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 11,480 parts In-Stock

1+ parts

-

100+ parts

$0.330

1k+ parts

$0.274

10k+ parts

$0.244

11,480

-

$0.330

$0.274

$0.244

DigiKey

USA . 11,480 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.410

10k+ parts

-

11,480

-

-

$0.410

-

Verical

USA . 11,480 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.305

11,480

-

-

-

$0.305

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 705 parts In-Stock

1+ parts

$0.257

100+ parts

-

1k+ parts

-

10k+ parts

-

705

$0.257

-

-

-

Vyrian

USA . 2,029 parts In-Stock

1+ parts

$0.271

100+ parts

-

1k+ parts

-

10k+ parts

-

2,029

$0.271

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,694 parts In-Stock

1+ parts

$0.244

100+ parts

-

1k+ parts

-

10k+ parts

-

1,694

$0.244

-

-

-

Corohmni

South Africa . 369 parts In-Stock

1+ parts

$0.271

100+ parts

-

1k+ parts

-

10k+ parts

-

369

$0.271

-

-

-

Component Stockers USA

USA . 8,039 parts In-Stock

1+ parts

$0.280

100+ parts

$0.260

1k+ parts

$0.240

10k+ parts

$0.240

8,039

$0.280

$0.260

$0.240

$0.240

Kepictronics

USA . 13,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

13,000

-

-

-

-

Continental Prestige Electronics

USA . 11,480 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.248

10k+ parts

-

11,480

-

-

$0.248

-

SupplyDigital Components

Austria . 7,101 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,101

-

-

-

-

TANS Electronics

Latvia . 6,986 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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6,986

-

-

-

-

Problanco Electronics

Mexico . 6,426 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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6,426

-

-

-

-

Kulean Microsystems

USA . 3,706 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,706

-

-

-

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UHIMA Technologies

Türkiye . 606 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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606

-

-

-

-

Overview

Unleash the power of innovation with the NVD4809NT4G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability in their Power Field Effect Transistors (FET). Ideal for a variety of applications, this N-CHANNEL FET offers unmatched performance and efficiency. Experience the value and benefits of this product with its high maximum drain current and power dissipation, along with its cutting-edge METAL-OXIDE SEMICONDUCTOR technology. Elevate your projects to new heights with the NVD4809NT4G from Onsemi.

Feature Benefit Bullets

Polarity or Channel Type N-CHANNEL

N-CHANNEL FETs typically offer lower ON resistance and higher efficiency compared to P-CHANNEL FETs, making them a preferred choice for many applications.

Configuration SINGLE

Single configuration FETs are simpler to design with and integrate into circuits, providing ease of use and straightforward operation.

Surface Mount YES

Surface mount FETs are easy to mount on PCBs, saving space and simplifying manufacturing processes.

Maximum Drain Current (Abs) (ID) 58 A

High maximum drain current rating allows for handling higher power loads, making this FET suitable for applications requiring high current capabilities.

Maximum Power Dissipation (Abs) 52 W

High maximum power dissipation capability ensures the FET can handle high power levels without overheating, improving reliability.

Field Effect Transistor Technology METAL-OXIDE SEMICONDUCTOR

Metal-Oxide Semiconductor technology offers good performance characteristics and durability, making the FET a reliable choice for various applications.

Maximum Operating Temperature 175 °C

High maximum operating temperature allows the FET to operate in harsh environments without performance degradation, increasing versatility.

Terminal Finish TIN

Tin terminal finish provides good solderability and corrosion resistance, ensuring reliable connections and long-term stability.

Technical Specifications

Power Field Effect Transistors (FET) NVD4809NT4G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

58 A

Maximum Drain Current (ID):

58 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Maximum Operating Temperature:

175 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Trade Compliance

NVD4809NT4G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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