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NTLUD3A260PZTBG

Onsemi

NTLUD3A260PZTBG by Onsemi

NTLUD3A260PZTBG by Onsemi is a P-CHANNEL FET with 2 elements and built-in diode, ideal for SWITCHING applications. It features a Max Drain Current of 1.7A, Max Power Dissipation of 1.3W, and Max Operating Temperature of 150 °C. This small outline transistor has a Drain terminal connection and operates in ENHANCEMENT MODE.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Flip Electronics (Authorized)

USA . 2,603 parts In-Stock

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Vyrian

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USA . 2,603 parts In-Stock

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Digiode

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AZTECH Wire

Italy . 1,008 parts In-Stock

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Perfect Parts

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Kulean Microsystems

USA . 7,825 parts In-Stock

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Kepictronics

USA . 7,000 parts In-Stock

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Problanco Electronics

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A-Z Elektronik GmbH

Germany . 2,700 parts In-Stock

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Corphita

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Türkiye . 855 parts In-Stock

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SupplyDigital Components

Austria . 532 parts In-Stock

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Futuretech Components

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Overview

Delivering exceptional performance and reliability, the NTLUD3A260PZTBG by Onsemi is a game-changer in the world of Small Signal Field Effect Transistors. With a focus on quality and innovation, Onsemi has crafted a product that excels in applications such as switching with its P-Channel configuration and 2 built-in diodes. Customers can count on this transistor for seamless operation, enhanced efficiency, and superior power dissipation, making it an essential component for any project. Elevate your electronics with the NTLUD3A260PZTBG and experience the difference that Onsemi brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and helps protect the internal components of the transistor, making it reliable for long-term use.

Polarity or Channel Type: P-CHANNEL

P-channel FETs have lower resistance and higher current handling capabilities compared to N-channel FETs, making them suitable for high-power applications.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

This configuration allows for more flexibility in circuit design and the built-in diode helps protect against reverse voltage spikes.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient and reliable performance when used in circuits that require on/off control.

Surface Mount: YES

Surface mount packaging allows for easy and compact integration onto circuit boards, saving space and simplifying assembly.

Minimum DS Breakdown Voltage: 20 V

With a breakdown voltage of 20V, this FET can handle higher voltage levels, making it suitable for a wide range of applications.

Package Shape: SQUARE

The square shape of the package simplifies placement on circuit boards and allows for efficient use of space in densely populated layouts.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors are normally off and can be turned on when a suitable voltage is applied, providing more control over the switching operation.

Maximum Drain Current (Abs) (ID): 1.7 A

With a high maximum drain current rating, this FET can handle higher current loads, making it suitable for power-hungry applications.

Maximum Power Dissipation (Abs): 1.3 W

The high power dissipation rating ensures that the FET can handle heat generated during operation without risking damage to the device.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board and facilitates easier assembly in compact electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high switching speeds and low on-resistance, making this transistor suitable for high-frequency switching applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can withstand elevated temperatures in various applications without performance degradation.

Transistor Element Material: SILICON

Silicon is a widely used semiconductor material known for its reliability and performance, ensuring the durability of the transistor.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and corrosion resistance, ensuring reliable connections in the circuit.

Maximum Drain Current (ID): 1.3 A

The maximum drain current rating of 1.3A ensures that the FET can handle moderate current loads without overheating or damage.

Maximum Drain-Source On Resistance: 0.2 ohm

With a low on-resistance, this FET minimizes power loss and heat generation, making it energy-efficient for switching applications.

Terminal Position: DUAL

The dual terminal position provides flexibility in circuit layout and connection options, allowing for versatile application possibilities.

Case Connection: DRAIN

The drain connection simplifies the circuit design and makes it easier to implement the FET in various switching configurations.

Maximum Time At Peak Reflow Temperature (s): 30

This FET can withstand peak reflow temperatures for up to 30 seconds, ensuring reliable soldering during assembly without causing damage to the device.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260 °C allows for effective soldering of the FET onto the circuit board, creating strong and reliable electrical connections.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTLUD3A260PZTBG attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

1.7 A

Maximum Drain Current (ID):

1.3 A

Maximum Drain-Source On Resistance:

.2 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-PDSO-N6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTLUD3A260PZTBG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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