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NTJD4401NT1

Onsemi

NTJD4401NT1 by Onsemi

NTJD4401NT1 by Onsemi is a N-CHANNEL FET with 2 elements, diode, and resistor for SWITCHING applications. Features include 20V DS Breakdown Voltage, 0.63A Drain Current, and 0.375ohm On Resistance. Its GULL WING terminals and SMALL OUTLINE package make it suitable for surface mount designs.

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Vyrian

USA . 4,515 parts In-Stock

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Advanced Electronics

New Zealand . 20 parts In-Stock

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$1.096

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20

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AZTECH Wire

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SupplyDigital Components

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TANS Electronics

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Corphita

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Kulean Microsystems

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Problanco Electronics

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Overview

Discover the NTJD4401NT1 by Onsemi, a high-quality Small Signal Field Effect Transistor (FET) designed for switching applications. With a compact package body made of durable plastic/epoxy material, this N-channel transistor features a unique configuration of separate elements with built-in diode and resistor. Offering a maximum drain current of 0.63 A and an operating temperature of up to 150 °C, this enhancement mode transistor is perfect for various electronic projects. Trust Onsemi's expertise in semiconductor technology and elevate your designs with the NTJD4401NT1 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the transistor.

Polarity or Channel Type: N-CHANNEL

Allows for efficient electron flow and improved overall performance.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE AND RESISTOR

Offers versatility and flexibility in circuit design, making it suitable for various applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable and fast operation.

Surface Mount: YES

Enables easy and convenient installation on printed circuit boards.

Minimum DS Breakdown Voltage: 20 V

Provides a sufficient margin of safety for voltage spikes in the circuit.

Package Shape: RECTANGULAR

Facilitates compact and efficient packaging in electronic devices.

Terminal Form: GULL WING

Allows for easy soldering and connection to other circuit components.

Operating Mode: ENHANCEMENT MODE

Enhances the transistor's performance characteristics, such as gain and efficiency.

No. of Elements: 2

Provides the necessary functionality for a wide range of circuit designs.

Maximum Drain Current (Abs) (ID): 0.63 A

Can handle relatively high current loads, making it suitable for power applications.

No. of Terminals: 6

Offers flexibility in circuit connections and configurations.

Maximum Power Dissipation (Abs): 0.55 W

Can dissipate heat effectively, ensuring the transistor operates within safe temperature limits.

Package Style (Meter): SMALL OUTLINE

Saves space on the PCB and allows for more compact device designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Provides consistent and reliable performance in various operating conditions.

Maximum Operating Temperature: 150 °C

Can withstand high operating temperatures, making it suitable for harsh environments.

Transistor Element Material: SILICON

Offers excellent electrical properties and reliability for long-term operation.

Terminal Finish: Tin/Lead (Sn/Pb)

Ensures good solderability and conductivity for stable electrical connections.

Maximum Drain-Source On Resistance: 0.375 ohm

Provides low resistance for efficient current flow and minimal power loss.

Terminal Position: DUAL

Allows for easy integration into both single-ended and differential circuits.

Peak Reflow Temperature °C: 235

Can withstand high reflow temperatures during the manufacturing process.

Maximum Feedback Capacitance (Crss): 5 pF

Has low feedback capacitance, ensuring stable and predictable circuit behavior.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTJD4401NT1 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

.63 A

Maximum Drain Current (ID):

.63 A

Maximum Drain-Source On Resistance:

.375 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

5 pF

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e0

No. of Elements:

2

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTJD4401NT1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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