Loading...

NTJD4158CT2G

Onsemi

NTJD4158CT2G by Onsemi

NTJD4158CT2G by Onsemi is a Small Signal FET with N/P-Channel, 2 elements, diode & resistor. It's used for switching applications in enhancement mode. Features include 30V breakdown voltage, 0.27W power dissipation, and -55 to 150 °C operating temperature range.

Median Price

-

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 364,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

364,500

-

-

-

-

Vyrian

USA . 4,098 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,098

-

-

-

-

A&K Electronics

USA . 2,601 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,601

-

-

-

-

Bristol Electronics

USA . 2,601 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,601

-

-

-

-

Digiode

USA . 502 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

502

-

-

-

-

Rotakorn

Sweden . 435 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

435

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 63 parts In-Stock

1+ parts

$21.970

100+ parts

-

1k+ parts

-

10k+ parts

-

63

$21.970

-

-

-

TANS Electronics

Latvia . 6,795 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,795

-

-

-

-

A-Z Elektronik GmbH

Germany . 4,539 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,539

-

-

-

-

Kepictronics

USA . 3,330 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,330

-

-

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

SupplyDigital Components

Austria . 2,915 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,915

-

-

-

-

Kulean Microsystems

USA . 2,132 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,132

-

-

-

-

Corphita

USA . 1,834 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,834

-

-

-

-

Problanco Electronics

Mexico . 1,198 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,198

-

-

-

-

Assy Fe

Spain . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

UHIMA Technologies

Türkiye . 962 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

962

-

-

-

-

Corohmni

South Africa . 57 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

57

-

-

-

-

Overview

Discover the NTJD4158CT2G by Onsemi, a high-quality Small Signal Field Effect Transistor that offers unparalleled performance in switching applications. With Onsemi's reputation for excellence in semiconductor manufacturing, this transistor is designed to exceed expectations with its reliable functionality and ease of use. Whether you're looking to enhance your electronic devices or improve efficiency in your circuits, this N-CHANNEL AND P-CHANNEL transistor with built-in diode and resistor is the perfect choice. Experience the value and benefits of this cutting-edge technology today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, making it suitable for various environments.

Polarity or Channel Type: N-CHANNEL AND P-CHANNEL

Allows for versatility in circuit design and applications.

Transistor Application: SWITCHING

Ideal for applications requiring high speed switching capabilities.

Surface Mount: YES

Enables easy and efficient PCB mounting for space-saving solutions.

Minimum DS Breakdown Voltage: 30 V

Can withstand high voltages, ensuring reliability in voltage regulation.

Maximum Power Dissipation (Abs): 0.27 W

Efficient power handling capability for reliable performance.

Maximum Operating Temperature: 150 °C

Suitable for high-temperature environments and applications.

Maximum Drain Current (ID): 0.25 A

Capable of handling moderate current levels for various applications.

Maximum Drain-Source On Resistance: 2.5 ohm

Low resistance allows for efficient power transfer in switching applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Offers high performance and reliability in semiconductor technology.

Maximum Feedback Capacitance (Crss): 12 pF

Low feedback capacitance ensures stability in high-frequency applications.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTJD4158CT2G attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

.25 A

Maximum Drain-Source On Resistance:

2.5 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

12 pF

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTJD4158CT2G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20