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NTHD3101FT3G

Onsemi

NTHD3101FT3G by Onsemi

NTHD3101FT3G by Onsemi is a P-CHANNEL FET with 20V DS Breakdown Voltage, ideal for SWITCHING applications. It features 13A IDM, 0.08 ohm RDS(on), and operates in ENHANCEMENT MODE. This SMALL OUTLINE transistor has DUAL terminals and a built-in diode for efficient power management.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 6,581 parts In-Stock

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Digiode

USA . 630 parts In-Stock

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Advanced Electronics

New Zealand . 4,172 parts In-Stock

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$2.084

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$2.064

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$1.980

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AZTECH Wire

Italy . 1,158 parts In-Stock

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$15.250

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QUARKTWIN TECHNOLOGY LTD

USA . 21,542 parts In-Stock

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Kulean Microsystems

USA . 6,339 parts In-Stock

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TANS Electronics

Latvia . 4,536 parts In-Stock

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Problanco Electronics

Mexico . 4,060 parts In-Stock

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SupplyDigital Components

Austria . 3,957 parts In-Stock

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Corphita

USA . 1,544 parts In-Stock

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UHIMA Technologies

Türkiye . 267 parts In-Stock

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Corohmni

South Africa . 141 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the NTHD3101FT3G by Onsemi. As a leader in the industry, Onsemi delivers top-quality Power FETs that are perfect for a wide range of applications including switching. With a P-CHANNEL polarity and a built-in diode, this transistor offers enhanced performance and efficiency. Experience seamless operation and superior reliability with the NTHD3101FT3G, designed to meet your needs and exceed your expectations. Choose Onsemi for unrivaled quality and innovation in every product.

Feature Benefit Bullets

Polarity or Channel Type: P-CHANNEL

P-CHANNEL FETs have lower on-state resistance and can offer higher current-carrying capability compared to N-CHANNEL FETs, making them suitable for specific applications.

Minimum DS Breakdown Voltage: 20 V

With a minimum breakdown voltage of 20 V, this FET can handle higher voltages and is suitable for applications requiring a higher voltage tolerance.

Maximum Pulsed Drain Current (IDM): 13 A

The high maximum pulsed drain current allows this FET to handle short-duration high current pulses effectively, making it suitable for applications with transient loads.

Maximum Drain Current (ID): 3.2 A

The maximum drain current of 3.2 A indicates the continuous current-carrying capability of this FET, making it suitable for applications with moderate current requirements.

Maximum Drain-Source On Resistance: 0.08 ohm

The low on-resistance of 0.08 ohm ensures minimal power losses and efficient operation of the FET, making it suitable for high-efficiency applications.

Technical Specifications

Power Field Effect Transistors (FET) NTHD3101FT3G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (ID):

3.2 A

Maximum Drain-Source On Resistance:

.08 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-XDSO-C8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

13 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

C BEND

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTHD3101FT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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