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NTHD3100CT1

Onsemi

NTHD3100CT1 by Onsemi

NTHD3100CT1 by Onsemi is a Power FET with N-CHANNEL and P-CHANNEL configurations, ideal for SWITCHING applications. It features 2 elements with built-in diode, max drain current of 3.2A, and 0.08 ohm on-resistance. Operating at up to 150 °C, this MOSFET is suitable for various power management tasks in electronics.

Median Price

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Lifecycle Status

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5

In-Stock Inventory

1k+

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Chip Stock

USA . 25,500 parts In-Stock

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Vyrian

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QIE Inc.

USA . 2,948 parts In-Stock

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NPI Materials, Inc.

USA . 912 parts In-Stock

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Digiode

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AZTECH Wire

Italy . 113 parts In-Stock

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Problanco Electronics

Mexico . 7,920 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,371 parts In-Stock

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Kulean Microsystems

USA . 6,675 parts In-Stock

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SupplyDigital Components

Austria . 5,419 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 887 parts In-Stock

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Futuretech Components

Singapore . 509 parts In-Stock

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TANS Electronics

Latvia . 497 parts In-Stock

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South Africa . 474 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the NTHD3100CT1 by Onsemi. This top-of-the-line Power Field Effect Transistor (FET) boasts unmatched quality and reliability, thanks to its renowned manufacturer. Ideal for switching applications, this N-CHANNEL AND P-CHANNEL transistor offers seamless performance in a compact package. Say goodbye to inefficiency and hello to enhanced productivity with the NTHD3100CT1. Experience the ultimate value and benefits that only Onsemi can deliver.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL AND P-CHANNEL

Offers both N-channel and P-channel options, providing versatility for various circuit designs.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

Allows for better control and flexibility in circuit configurations, with built-in diode for protection.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient and reliable operation.

Minimum DS Breakdown Voltage: 20 V

With a minimum breakdown voltage of 20 V, it can handle higher voltages without damage.

Package Shape: RECTANGULAR

Rectangular shape allows for easy placement and mounting on PCBs.

Operating Mode: ENHANCEMENT MODE

Operates in enhancement mode, offering faster response times and better performance.

Maximum Pulsed Drain Current (IDM): 12 A

Capable of handling high current pulses, making it suitable for demanding applications.

Maximum Drain Current (Abs) (ID): 3.2 A

With a maximum drain current of 3.2 A, it can handle moderate current loads.

Maximum Power Dissipation (Abs): 1.1 W

Can dissipate up to 1.1 W of power, ensuring reliable performance under varying loads.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizes MOSFET technology for improved efficiency and performance.

Maximum Operating Temperature: 150 °C

Can operate at temperatures up to 150 °C, suitable for high-temperature environments.

Maximum Drain-Source On Resistance: 0.08 ohm

Low on-resistance reduces power loss and improves efficiency in switching applications.

Technical Specifications

Power Field Effect Transistors (FET) NTHD3100CT1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

3.2 A

Maximum Drain Current (ID):

2.9 A

Maximum Drain-Source On Resistance:

.08 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-XDSO-C8

JESD-609 Code:

e0

No. of Elements:

2

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

12 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

C BEND

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTHD3100CT1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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