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NTHD3101FT1

Onsemi

NTHD3101FT1 by Onsemi

NTHD3101FT1 by Onsemi is a P-CHANNEL FET with 20V DS breakdown voltage, ideal for switching applications. It features a max IDM of 13A and 0.08 ohm RDS(on), suitable for enhancement mode operation. This MOSFET comes in an 8-terminal package style with built-in diode, making it perfect for surface mount designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Cyclops Electronics Ltd

UK . 3,000 parts In-Stock

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Vyrian

USA . 1,970 parts In-Stock

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Digiode

USA . 52 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,283 parts In-Stock

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SupplyDigital Components

Austria . 7,216 parts In-Stock

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TANS Electronics

Latvia . 7,012 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Kepictronics

USA . 3,500 parts In-Stock

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3,500

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Kulean Microsystems

USA . 2,049 parts In-Stock

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Problanco Electronics

Mexico . 1,552 parts In-Stock

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Corphita

USA . 396 parts In-Stock

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Corohmni

South Africa . 112 parts In-Stock

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UHIMA Technologies

Türkiye . 21 parts In-Stock

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Overview

Experience superior performance and reliability with the NTHD3101FT1 Power Field Effect Transistor by Onsemi. This P-Channel transistor boasts a single configuration with a built-in diode, making it ideal for switching applications. With a maximum pulsed drain current of 13A and a minimum DS breakdown voltage of 20V, this transistor offers unmatched efficiency and durability. Whether you're designing power supplies, motor controls, or LED lighting systems, this transistor delivers the power and precision you need. Trust Onsemi's reputation for quality and innovation, and elevate your designs with the NTHD3101FT1.

Feature Benefit Bullets

Polarity or Channel Type: P-CHANNEL

P-CHANNEL FETs are known for their low on-resistance and high efficiency, making them ideal for applications where power savings are important.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects against reverse current flow, adding value to the product.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable performance in on/off control scenarios.

Surface Mount: YES

Surface mount technology offers space-saving benefits and allows for automated assembly, making the product suitable for compact designs and mass production.

Minimum DS Breakdown Voltage: 20 V

Provides a suitable voltage rating for applications requiring a minimum breakdown voltage of 20V.

Package Shape: RECTANGULAR

Rectangular package shape offers easy integration into circuit boards and provides a standardized form factor for compatibility with various systems.

Transistor Element Material: SILICON

Silicon-based FETs are known for their superior performance, reliability, and temperature stability, making them a preferred choice in semiconductor applications.

Maximum Drain-Source On Resistance: 0.08 ohm

Low on-resistance minimizes power loss and heat generation, improving overall efficiency and performance of the device.

Technical Specifications

Power Field Effect Transistors (FET) NTHD3101FT1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (ID):

3.2 A

Maximum Drain-Source On Resistance:

.08 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-XDSO-C8

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

13 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

C BEND

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTHD3101FT1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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