Loading...

NTHD3100CT3G

Onsemi

NTHD3100CT3G by Onsemi

NTHD3100CT3G by Onsemi is a Power FET with N/P-Channel, 2 elements w/ diode. Ideal for switching applications, it has max drain current of 3.2A, on-resistance of 0.08 ohm, and max power dissipation of 1.1W. Operating at up to 150 °C, it's a surface-mount transistor in small outline package suitable for various electronic designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,036 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,036

-

-

-

-

QIE Inc.

USA . 4,644 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,644

-

-

-

-

Digiode

USA . 272 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

272

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 152 parts In-Stock

1+ parts

$18.360

100+ parts

-

1k+ parts

-

10k+ parts

-

152

$18.360

-

-

-

Problanco Electronics

Mexico . 7,497 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,497

-

-

-

-

SupplyDigital Components

Austria . 5,435 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,435

-

-

-

-

TANS Electronics

Latvia . 4,163 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,163

-

-

-

-

Kulean Microsystems

USA . 1,565 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,565

-

-

-

-

Corphita

USA . 767 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

767

-

-

-

-

Corohmni

South Africa . 457 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

457

-

-

-

-

UHIMA Technologies

Türkiye . 112 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

112

-

-

-

-

Overview

Experience unprecedented power and efficiency with the NTHD3100CT3G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability in their Power Field Effect Transistors (FET). Ideal for switching applications, this transistor boasts N-CHANNEL AND P-CHANNEL polarity, separate configuration with built-in diode, and an impressive operating mode of ENHANCEMENT MODE. With a maximum pulsed drain current of 12 A and a maximum drain-source on resistance of 0.08 ohm, this product ensures optimal performance and durability. Elevate your projects with the NTHD3100CT3G and experience superior results like never before.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL AND P-CHANNEL

Having both N-Channel and P-Channel types allows for more versatility in various circuit designs.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

The separate configuration with built-in diode helps to improve efficiency and protect the transistor from voltage spikes.

Transistor Application: SWITCHING

Designed specifically for switching applications, making it reliable and efficient in controlling power flow.

Surface Mount: YES

Surface mount capability makes installation easier and saves space on the circuit board.

Minimum DS Breakdown Voltage: 20 V

With a minimum breakdown voltage of 20V, this transistor can handle higher voltage applications.

Package Shape: RECTANGULAR

Rectangular shape allows for easy placement and soldering on the circuit board.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation provides better control and efficiency in switching applications.

Maximum Pulsed Drain Current (IDM): 12 A

High maximum pulsed drain current capability allows for handling transient loads effectively.

Maximum Drain Current (Abs) (ID): 3.2 A

With a maximum drain current of 3.2A, this transistor can handle moderate power loads.

No. of Terminals: 8

Having 8 terminals provides flexibility in connecting to other components in the circuit.

Maximum Power Dissipation (Abs): 1.1 W

Low power dissipation ensures minimal heat generation and improves overall efficiency.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board and allows for compact designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance and reliability in power switching applications.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this transistor can operate in high-temperature environments.

Transistor Element Material: SILICON

Silicon material provides good thermal conductivity and ensures long-term reliability of the transistor.

Terminal Finish: TIN

Tin terminal finish offers good solderability and corrosion resistance for long-lasting performance.

Maximum Drain-Source On Resistance: 0.08 ohm

Low drain-source on resistance ensures minimal power loss and improves efficiency in power switching applications.

Terminal Position: DUAL

Dual terminal position allows for easy connection and integration into different circuit configurations.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260 °C, this transistor can withstand high-temperature soldering processes.

Technical Specifications

Power Field Effect Transistors (FET) NTHD3100CT3G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

3.2 A

Maximum Drain Current (ID):

2.9 A

Maximum Drain-Source On Resistance:

.08 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-XDSO-C8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

12 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

C BEND

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTHD3100CT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 16